XCZU65DR-1FFVE1156I

XCZU65DR-1FFVE1156I

$14,583.88
  • Description:IC ZUP RFSOC A53 FPGA 1156BGA
  • Series:Zynq® UltraScale+™ RFSoC

SKU:fc021bcd3bef Category: Brand:

  
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Product Detailed Parameters

  • Description:IC ZUP RFSOC A53 FPGA 1156BGA
  • Series:Zynq® UltraScale+™ RFSoC
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:-
  • Connectivity:-
  • Speed:500MHz, 1.2GHz
  • Primary Attributes:Zynq® UltraScale+™ RFSoC
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:1156-BBGA, FCBGA
  • Supplier Device Package:1156-FCBGA (35x35)

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XCZU65DR-1FFVE1156I

Overview

The AMD XCZU65DR-1FFVE1156I is a Zynq UltraScale+ RFSoC device featuring an FCBGA-1156 package. It integrates a processing system with four ARM Cortex-A53 cores and two ARM Cortex-R5 cores, alongside programmable logic. The device supports operating frequencies of 500 MHz for the A53 cores and 1.2 GHz for the R5 cores. It includes 256 KB of RAM and operates within a junction temperature range of -40°C to 100°C. The component is RoHS3 compliant and has a Moisture Sensitivity Level (MSL) of 4.

Feature Summary

  • Integrates quad-core ARM Cortex-A53 and dual-core ARM Cortex-R5 processors with CoreSight debug support
  • Includes integrated RF data converters as part of the Zynq UltraScale+ RFSoC architecture
  • Available in a 1156-ball FCBGA package measuring 35x35 mm

Applications

  • Software-defined radio systems
  • Test and measurement equipment
  • Wireless infrastructure base stations

Procurement Notes

Verify the specific suffix 'I' indicates industrial temperature rating compliance. Confirm package dimensions match the 1156-FCBGA specification. Check for RoHS3 certification status before integration. Ensure ESD handling procedures are followed due to MSL 4 classification. Validate availability through authorized AMD distributors as standard stock may be limited.

Selection Notes

Select this model when high-performance RF sampling combined with embedded processing is required. Compare against other RFSoC variants based on the number of integrated ADCs/DACs and total logic resources. Ensure the 1156-pin footprint fits the target PCB layout constraints. Verify power supply requirements align with the 500 MHz and 1.2 GHz core specifications.

Part Context

This component belongs to the Zynq UltraScale+ RFSoC family, designed for applications requiring direct RF sampling. It combines Xilinx FPGA fabric with ARM processor subsystems and high-speed analog-to-digital converters. The device targets complex signal processing tasks in communications and defense sectors.

XCZU65DR-1FFVE1156IXCZU65DR-1FFVE1156I
$14,583.88
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