XCZU65DR-2FFVE1156I

Overview

The XCZU65DR-2FFVE1156I is a Zynq UltraScale+ RFSoC from AMD, integrating an ARM processing system, programmable logic, and high-speed RF data converters. It features four ARM Cortex-A53 cores and dual ARM Cortex-R5 cores within the processing subsystem. The device includes eight 14-bit RF ADCs with a maximum sampling rate of 5 GSPS and eight 14-bit RF DACs operating up to 9.85 GSPS. It utilizes a 1156-pin FCBGA package (35x35 mm) and supports industrial temperature ranges.

Feature Summary

• Integrated RF Transceivers: Eight 14-bit RF ADCs (5 GSPS) and eight 14-bit RF DACs (9.85 GSPS) for direct RF sampling.
• Heterogeneous Processing: Quad-core ARM Cortex-A53 application processors and dual-core ARM Cortex-R5 real-time processors.
• High-Density Logic: Large FPGA fabric optimized for complex signal processing tasks such as beamforming and filtering.
• Advanced Packaging: 1156-ball FCBGA package providing robust thermal dissipation and high I/O density.

Applications

• 5G NR Base Stations
• Phased Array Radar Systems
• Software Defined Radio (SDR)
• Electronic Warfare Systems

Procurement Notes

Verify export control status prior to ordering, as this component may require additional documentation for international shipment. Confirm the specific speed grade suffix matches design requirements. Ensure supply chain sources provide original manufacturer packaging and authenticity certificates to mitigate counterfeit risks in high-reliability applications.

Selection Notes

Select this model when multi-channel high-bandwidth RF conversion is required alongside substantial FPGA compute resources. Compare against lower-density DR variants if channel count or DSP slice availability exceeds project needs. Validate that the -2 speed grade meets timing constraints for target clock frequencies and interface protocols.

Part Context

This part belongs to the Zynq UltraScale+ RFSoC family, designed specifically for radio frequency applications. It consolidates functions previously requiring separate FPGA, ADC, and DAC chips into a single silicon solution. The DR designation indicates integration of both RF data converters and significant programmable logic resources.

Replacement Considerations

Direct pin-to-pin replacements are limited within the same package. Consider XCZU67DR variants for increased logic capacity or XCZU47DR for different performance profiles. Verify compatibility with existing board layouts and thermal designs when migrating between series.