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— IC芯片 | 连接器 | 传感器 | 被动器件 —
The XCZU65DR-2FSVE1156I is a Zynq UltraScale+ RFSoC manufactured by AMD, designed for high-performance radio frequency applications. It integrates a Processing System with quad-core ARM Cortex-A53 and dual-core ARM Cortex-R5 processors alongside Programmable Logic built on 16nm FinFET technology. The device features eight 14-bit RF ADCs and eight 14-bit RF DACs capable of sampling rates up to 5 GSPS. Encased in a 1156-pin FCBGA package measuring 35x35 mm, it supports industrial operating temperatures ranging from -40°C to +100°C TJ.
Verify the specific speed grade suffix '2' against design requirements, as it dictates maximum clock frequencies for both the Processing System and Programmable Logic. Confirm thermal management solutions are adequate for the 1156-FCBGA package under full load conditions. Ensure supply chain sources provide original manufacturer documentation to validate authenticity and traceability.
Select this model when eight independent RF channels are required for simultaneous transmit and receive operations. Compare against the XCZU65DR-1 variant if lower speed grades suffice for the target application. Consider the XCZU67DR series if higher logic capacity or different I/O configurations are necessary for complex system integration.
This component belongs to the Zynq UltraScale+ RFSoC family, which merges traditional SoC capabilities with direct RF conversion. It serves as a central processing unit in modern communication architectures, replacing discrete analog front-ends with integrated digital solutions. The DR designation indicates specific resource configurations within the UltraScale+ portfolio.
Direct pin-to-pin replacements within the same package include other XCZU65DR variants with different speed grades, such as XCZU65DR-1FFVE1156I. Cross-family migration to XCZU67DR models requires schematic and firmware adaptation due to differing logic resources and I/O counts.