XCZU67DR-L2FSVE1156I

Overview

The XCZU67DR-L2FSVE1156I is a Zynq UltraScale+ RFSoC device manufactured by AMD. It integrates a quad-core ARM Cortex-A53 application processor, dual-core ARM Cortex-R5F real-time processor, and high-performance programmable logic with integrated RF data converters. The component utilizes an FCBGA-1156 package and operates within the industrial temperature range of -40°C to 100°C. This SoC FPGA combines processing, logic, and analog conversion capabilities for complex signal processing applications.

Feature Summary

• Integrated Zynq UltraScale+ RFSoC architecture combining ARM processors, FPGA fabric, and RF ADCs/DACs
• Quad-core ARM Cortex-A53 MPCore and dual-core ARM Cortex-R5F embedded processors
• FCBGA-1156 package (35x35 mm) suitable for surface mount installation
• Industrial temperature rating (-40°C to 100°C TJ)

Applications

• 5G NR and O-RAN base station implementations
• Phased array radar and electronic warfare systems
• Satellite communication ground stations
• Wideband signal intelligence and spectrum monitoring

Procurement Notes

Availability for the XCZU67DR-L2FSVE1156I is currently restricted or limited. Distributors such as Mouser indicate that this specific part number may not be in active stock and could require factory special orders. Verification of current supply status and lead times is necessary before procurement planning due to potential allocation constraints.

Selection Notes

Select the XCZU67DR-L2FSVE1156I when multi-channel direct RF sampling is required alongside significant programmable logic resources. The L2 speed grade indicates specific timing performance characteristics. Ensure the design accommodates the thermal requirements of the FCBGA-1156 package and utilizes appropriate development tools compatible with the Zynq UltraScale+ RFSoC family.

Part Context

This component belongs to the XCZU67DR series within the Zynq UltraScale+ RFSoC portfolio. It shares architectural similarities with other DR-series devices like the XCZU47DR and XCZU65DR but offers distinct resource allocations for logic cells, DSP slices, and memory. The suffix L2FSVE1156I denotes the package type, speed grade, and temperature range.

Replacement Considerations

Direct pin-to-pin replacements within the same package are limited to other XCZU67DR variants with different speed grades or temperature ratings. Cross-family migration to MPSoC or standard UltraScale+ devices requires significant schematic and firmware redesign.