SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The AMD XCZU6CG-1FFVB1156I is a Zynq UltraScale+ MPSoC device featuring an FPGA fabric with approximately 469K logic cells. It integrates dual ARM Cortex-A53 application processors and dual ARM Cortex-R5 real-time processors, both equipped with CoreSight debug interfaces. The component operates within a junction temperature range of -40°C to +100°C and utilizes a 1156-ball FCBGA package measuring 35x35 mm. Key specifications include a maximum processor frequency of 1.2 GHz for the A53 cores and 500 MHz for the R5 cores, alongside integrated DMA and watchdog timer peripherals.
Verify the specific suffix 'I' indicates industrial temperature rating (-40°C to +100°C). Confirm the package dimensions match the 1156-FCBGA (35x35) specification. Ensure compatibility with required power supply voltages and thermal management solutions for the specified operating range.
Select this model when dual-core processing is sufficient compared to quad-core variants like the XCZU6EG. Verify that the 469K logic cell count meets design requirements. Check if the 1156-pin footprint fits the PCB layout constraints. Compare against XCZU6CG-1FFVC900I if a smaller 900-ball package is acceptable.
This part belongs to the Zynq UltraScale+ MPSoC CG series, which targets cost-sensitive embedded applications. It shares the same processor architecture as higher-end EG models but offers reduced logic resources and fewer I/O pins. The CG series is designed for applications requiring balanced performance and form factor.
XCZU6CG-1FFVC900I: Same core architecture but in a 900-ball FCBGA package. XCZU6EG-1FFVB1156I: Quad-core A53 and additional Mali GPU, same package.