XCZU6CG-1FFVC900I

Overview

The XCZU6CG-1FFVC900I is a System-on-Chip FPGA from the AMD Xilinx Zynq UltraScale+ MPSoC CG series. It integrates programmable logic with processing systems featuring quad-core ARM Cortex-A53 and dual-core ARM Cortex-R5 processors. The device provides 287,400 logic elements, 16.1 Mbit of embedded memory, and 16 high-speed transceivers. It operates within an industrial temperature range of -40°C to +100°C and utilizes a 900-ball FCBGA package.

Feature Summary

• Integrated Processing System: Quad-core ARM Cortex-A53 (up to 600 MHz) and dual-core ARM Cortex-R5 (up to 1.5 GHz).
• Programmable Logic: 287,400 LEs, 16,416 ALMs, and 16.1 Mbit embedded memory.
• High-Speed I/O: 16 GTY/GTM transceivers supporting up to 12.5 Gbps.
• Package: 900-ball FCBGA (31x31 mm) suitable for surface mount applications.

Applications

• Industrial automation and control systems requiring real-time processing.
• Medical imaging equipment and diagnostic devices.
• Test and measurement instrumentation.
• Aerospace and defense avionics subsystems.

Procurement Notes

Verify component authenticity through authorized AMD distributors or certified partners. Confirm RoHS compliance and moisture sensitivity level (MSL) ratings prior to assembly. Ensure supply chain documentation matches the specific speed grade (-1) and package variant (FFVC900I) to avoid integration errors in production environments.

Selection Notes

Select this model when balancing moderate logic capacity with robust processing capabilities. The CG series targets cost-sensitive applications compared to higher-end EG/PG variants. Verify that the 16.1 Mbit memory budget and 16 transceiver count meet interface requirements before choosing over larger models like the XCZU9CG.

Part Context

This part belongs to the Zynq UltraScale+ MPSoC CG family, designed for embedded applications. It shares the same FFVC900 package footprint as other CG-series devices but differs in logic density and memory size. It serves as a mid-range solution within the broader Zynq portfolio, bridging the gap between lower-density EV series and higher-performance EG/PG series chips.

Replacement Considerations

Direct pin-to-pin replacements within the same package include other XCZU6CG variants with different speed grades (e.g., XCZU6CG-1FFVC900E). Cross-family substitutions require careful verification of pin compatibility and thermal constraints.