XCZU6CG-L1FFVC900I

XCZU6CG-L1FFVC900I

$2,824.13
  • Description:IC SOC CORTEX-A53 900FCBGA
  • Series:Zynq® UltraScale+™ MPSoC CG

SKU:2a157fcf066f Category: Brand:

  
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Product Detailed Parameters

  • Description:IC SOC CORTEX-A53 900FCBGA
  • Series:Zynq® UltraScale+™ MPSoC CG
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:500MHz, 1.2GHz
  • Primary Attributes:Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:900-BBGA, FCBGA
  • Supplier Device Package:900-FCBGA (31x31)

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XCZU6CG-L1FFVC900I

Overview

The AMD XCZU6CG-L1FFVC900I is a Zynq UltraScale+ MPSoC built on 16nm FinFET+ technology. It integrates a dual-core Arm Cortex-A53 application processor (up to 1.2 GHz) and a dual-core Arm Cortex-R5 real-time processor (up to 600 MHz). The programmable logic section contains 469K+ logic elements, 25.1 Mbit embedded block RAM, and 6.9 Mbit distributed RAM. The device features 24 high-speed GTH/GTY transceivers, 220 user I/Os, and an Arm Mali-400 MP2 GPU. It operates within a junction temperature range of -40°C to +100°C in a 900-pin FCBGA package.

Feature Summary

  • Dual-core Arm Cortex-A53 APU up to 1.2 GHz with NEON SIMD
  • Dual-core Arm Cortex-R5 RPU up to 600 MHz for deterministic control
  • 469K+ Logic Elements with 25.1 Mbit Block RAM and ECC support
  • 24 High-Speed Transceivers supporting PCIe Gen3/Gen4 and 100G Ethernet

Applications

  • Industrial automation and robotics controllers
  • 5G wireless infrastructure base stations
  • Automotive advanced driver assistance systems (ADAS)
  • Medical imaging equipment signal processing

Procurement Notes

Verify the specific suffix 'L1' against official AMD documentation to confirm it denotes the industrial temperature grade (-40°C to +100°C) and does not imply additional functional variations. Confirm moisture sensitivity level (MSL) requirements for surface-mount assembly processes. Ensure compatibility with the required power delivery network specifications for the 850 mV core voltage.

Selection Notes

Select this model when a balance of moderate FPGA capacity and dual-core ARM processing is required. Compare against the XCZU6CG-2FFVC900I if higher clock speeds or commercial temperature ranges are acceptable. Verify that the 900-ball FCBGA footprint fits the target PCB design constraints. Check if the 24 transceiver count meets bandwidth requirements for interfaces like SFP+ or QSFP.

Part Context

This component belongs to the Zynq UltraScale+ MPSoC CG series, which features dual-core Cortex-A53 processors. It sits below the EG series (quad-core A53 + GPU) in terms of application processing power but retains full programmable logic capabilities. The 'XCZU' prefix identifies it as a Zynq UltraScale+ device, while 'CG' specifies the dual-core APU configuration.

Replacement Considerations

Direct pin-to-pin replacements within the same package include other XCZU6CG variants such as XCZU6CG-2FFVC900I, provided electrical parameters like operating temperature and clock frequencies align with system requirements. Cross-series migration to XCZU7CG requires re-evaluation of the FPGA fabric size and I/O count.

XCZU6CG-L1FFVC900IXCZU6CG-L1FFVC900I
$2,824.13
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