XCZU6EG-1FFVB1156I

Overview

The XCZU6EG-1FFVB1156I is a Zynq UltraScale+ MPSoC EG series device manufactured by AMD. It integrates programmable logic with processing systems on a single die using 16nm FinFET+ technology. The component features 26,825.5 Adaptive Logic Modules (ALMs) and 25.1 Mbit of embedded memory. It includes a quad-core ARM Cortex-A53 MPCore running up to 1.5 GHz, dual-core ARM Cortex-R5 running up to 600 MHz, and an ARM Mali-400 MP2 GPU operating at 667 MHz. The device utilizes a 1156-ball FCBGA package and supports industrial temperature ranges from -40°C to +100°C.

Feature Summary

• Integrates 26,825.5 ALMs with 25.1 Mbit embedded block RAM and 6.9 Mbit distributed RAM.
• Processing system includes quad-core ARM Cortex-A53 (up to 1.5 GHz), dual-core ARM Cortex-R5 (up to 600 MHz), and ARM Mali-400 MP2 GPU (up to 667 MHz).
• Features 24 high-speed transceivers and 352 I/O pins in a 1156-FCBGA package.
• Supports DDR4, LPDDR4, DDR3, and other dynamic memory interfaces.

Applications

• Industrial automation and control systems
• Medical imaging equipment
• Test and measurement instrumentation
• Automotive infotainment and advanced driver assistance systems

Procurement Notes

Verify the specific suffix 'I' indicates the industrial temperature range (-40°C to +100°C) and 'E' denotes the EG variant with GPU support. Confirm package dimensions for the 1156-FCBGA form factor during mechanical design. Check current availability status as supply chain conditions may vary. Ensure EDA tools are compatible with the UltraScale+ architecture.

Selection Notes

Select this model when both high-performance application processing and real-time control are required alongside substantial FPGA fabric resources. Compare against the XCZU6CG variant if GPU acceleration is not needed, or the XCZU9EG if higher logic density is necessary. Evaluate power consumption requirements against the 850 mV core voltage specification. Consider thermal management solutions for the 1156-ball BGA package under maximum load conditions.

Part Context

This part belongs to the Zynq UltraScale+ MPSoC EG family, which specifically includes the ARM Mali-400 MP2 graphics processor. It sits between lower-density models like the XCZU3EG and higher-capacity devices such as the XCZU9EG within the same package footprint options. The EG designation distinguishes it from the CG series, which lacks the integrated GPU but shares similar CPU and FPGA resource configurations.

Replacement Considerations

Direct pin-to-pin replacements within the same package are limited to other XCZU6EG variants with different speed grades or temperature ratings. For functional equivalence with different resource levels, consider the XCZU9EG-2FFVB1156I for increased logic capacity or the XCZU6CG-1FFVB1156E if GPU functionality is unnecessary.