XCZU7CG-1FBVB900I

Overview

The XCZU7CG-1FBVB900I is a System on Chip (SoC) FPGA from the AMD Xilinx Zynq UltraScale+ MPSoC CG series. It integrates dual ARM Cortex-A53 MPCore processors with CoreSight, dual ARM Cortex-R5 processors with CoreSight, and an FPGA fabric containing over 504K logic cells. The device operates at clock frequencies of 500 MHz for the A53 cores and 1.2 GHz for the R5 cores. It features 204 I/O pins and utilizes a 900-ball FCBGA package measuring 31x31 mm. The component supports industrial temperature ranges from -40°C to +100°C.

Feature Summary

• Dual ARM Cortex-A53 MPCore processors running at 500 MHz
• Dual ARM Cortex-R5 processors running at 1.2 GHz
• FPGA fabric with 504K+ logic cells
• 900-ball FCBGA package (31x31 mm)

Applications

• Industrial automation controllers
• Medical imaging systems
• Automotive infotainment and instrument clusters

Procurement Notes

Verify the specific suffix 'I' indicates industrial temperature rating (-40°C to +100°C). Confirm the package type is FCBGA-900. Ensure compatibility with required power supply voltages and thermal management solutions for the 31x31 mm form factor. Check for RoHS compliance documentation.

Selection Notes

Select this model when dual-core processing is sufficient compared to higher-end EG or VG variants. Compare against XCZU7EG if additional GPU resources or higher core counts are not required. Verify that the 204 I/O count meets interface requirements. Consider the 504K logic cell capacity for complex programmable logic needs.

Part Context

This part belongs to the Zynq UltraScale+ MPSoC CG family, which targets cost-sensitive applications requiring embedded processing and FPGA flexibility. It shares the same FPGA architecture as the EG variant but differs in processor configuration and memory subsystems. The CG series is designed for high-volume industrial and consumer markets.

Replacement Considerations

Direct pin-to-pin replacements within the same package may include other CG series variants with different speed grades or memory configurations. Cross-family migration to Kintex UltraScale devices requires significant PCB and software redesign due to the absence of integrated ARM processors.