XCZU7EG-1FBVB900I

XCZU7EG-1FBVB900I

$2,951.63
  • Description:IC SOC CORTEX-A53 900FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EG

SKU:24aab4779f9d Category: Brand:

  
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Product Detailed Parameters

  • Description:IC SOC CORTEX-A53 900FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EG
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:500MHz, 600MHz, 1.2GHz
  • Primary Attributes:Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:900-BBGA, FCBGA
  • Supplier Device Package:900-FCBGA (31x31)

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XCZU7EG-1FBVB900I

Overview

The AMD XCZU7EG-1FBVB900I is a Zynq UltraScale+ MPSoC EG series System on Chip integrating programmable logic with ARM processors. It features four Cortex-A53 cores, dual Cortex-R5F cores, and an Mali-400 MP2 GPU. The device provides 504K+ logic cells, 11 Mbit embedded memory, and 24 high-speed transceivers. Operating at maximum frequencies of 600 MHz for R5, 667 MHz for A53, and 1.5 GHz for the fabric, it utilizes a 900-pin FCBGA package. The component supports industrial temperatures from -40°C to +100°C.

Feature Summary

  • Heterogeneous architecture combining quad-core ARM Cortex-A53, dual-core Cortex-R5F, and Mali-400 MP2 GPU
  • Programmable logic with 504K+ logic elements and 28,800 Adaptive Logic Modules (ALMs)
  • Integrated 11 Mbit embedded block RAM and 6.2 Mbit distributed RAM
  • 24 GTH/GTY transceivers supporting high-speed serial interfaces

Applications

  • Industrial automation and control systems
  • 5G wireless infrastructure equipment
  • Advanced Driver Assistance Systems (ADAS)
  • Medical imaging devices
  • Aerospace and defense avionics

Procurement Notes

Verify RoHS compliance status through official AMD documentation prior to integration. Confirm moisture sensitivity level (MSL 4) handling requirements during storage and assembly. Ensure supply chain sources provide valid traceability data for industrial grade components.

Selection Notes

Select this model when requiring specific integration of Mali-400 graphics with high-density FPGA resources. Compare against XCZU7CG variants if GPU acceleration is unnecessary. Validate that the 900-ball BGA footprint fits the target PCB layout constraints.

Part Context

This part belongs to the Zynq UltraScale+ MPSoC EG family, designed for applications demanding both real-time processing and complex hardware acceleration. It represents a convergence of ARM processor technology and Xilinx FPGA capabilities within a single silicon die.

Replacement Considerations

Direct pin-to-pin replacements are limited within the same package. Consider XCZU7EG-1FBVB900E for commercial temperature ranges or XCZU7EG-2FBVB900I for higher performance grades, subject to design verification.

XCZU7EG-1FBVB900IXCZU7EG-1FBVB900I
$2,951.63
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