XCZU7EG-L1FFVC1156I

XCZU7EG-L1FFVC1156I

$3,669.88
  • Description:IC SOC CORTEX-A53 1156FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EG

SKU:365c3f12c0d8 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC SOC CORTEX-A53 1156FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EG
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:500MHz, 600MHz, 1.2GHz
  • Primary Attributes:Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:1156-BBGA, FCBGA
  • Supplier Device Package:1156-FCBGA (35x35)

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XCZU7EG-L1FFVC1156I

Overview

The XCZU7EG-L1FFVC1156I is an UltraScale+ Embedded FPGA from AMD, featuring a Zynq UltraScale+ MPSoC architecture that integrates quad-core ARM Cortex-A53 processors with programmable logic. It utilizes a 16nm FinFET process technology to deliver high performance and low power consumption. The device includes embedded High Bandwidth Memory (HBM) for enhanced data throughput in demanding applications. Key specifications include up to 2.8 million logic cells, extensive DSP slices, and hardened PCIe Gen3 interfaces. The -L1 speed grade ensures optimized timing closure for complex designs.

Feature Summary

  • Quad-core ARM Cortex-A53 application processor subsystem with Linux support
  • Integrated HBM controller supporting high-bandwidth memory stacks
  • Hardened PCIe Gen3 x4 interface for high-speed data transfer
  • Advanced 16nm FinFET technology for power efficiency and density

Applications

  • Industrial automation and control systems
  • Medical imaging equipment requiring high processing throughput
  • Test and measurement instrumentation
  • Wireless infrastructure base stations

Procurement Notes

Verify the specific suffix 'I' indicates industrial temperature range operation (-40°C to +100°C). Confirm the package type FFVC1156 matches the required footprint on the PCB. Ensure the lot date code meets project requirements as availability may vary by region. Check for any specific RoHS compliance documentation if required by local regulations.

Selection Notes

Select this component when both high-performance computing via ARM cores and flexible logic implementation are required. The inclusion of HBM makes it suitable for applications needing large data buffers without external memory latency. Compare against lower-density models like the XCZU5EG if resource usage is minimal, or higher-end models if more logic cells are needed. Evaluate thermal management solutions due to the high pin count and power density.

Part Context

This part belongs to the Zynq UltraScale+ MPSoC family, bridging the gap between traditional FPGAs and SoCs. It succeeds earlier Zynq-7000 series devices by offering greater processing power and integrated memory controllers. The XCZU7EG variant specifically targets mid-range performance needs within the UltraScale+ portfolio, balancing cost and capability for embedded vision and AI inference tasks.

XCZU7EG-L1FFVC1156IXCZU7EG-L1FFVC1156I
$3,669.88
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