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The XCZU7EV-1FBVB900E is a Zynq UltraScale+ MPSoC from AMD/Xilinx, integrating an FPGA fabric with ARM-based processing systems. It features seven cores: dual Cortex-A53, quad Cortex-R5, and a Mali-400 MP2 GPU. The device offers 504,000 logic elements (28,800 ALMs) and 11 Mbit of embedded memory. Operating at maximum clock frequencies up to 1.5 GHz for the FPGA and 667 MHz for processors, it utilizes a 900-pin FCBGA package. The core voltage is specified at 850 mV, with an operating temperature range of 0°C to +100°C.
Verify the specific speed grade suffix (-1) against design timing requirements. Confirm RoHS compliance status through official manufacturer documentation. Ensure ESD protection protocols are followed during handling due to moisture sensitivity classification. Validate package dimensions against PCB footprint specifications before procurement.
Select this model when high core count and significant FPGA resources are required within a single SoC. Compare against lower-density variants like the XCZU4EG if resource utilization is lower. Consider thermal management solutions given the 850 mV core voltage and power density. Verify that the 900-ball BGA package fits the target board layout constraints.
This component belongs to the Zynq UltraScale+ MPSoC family, specifically the EV series designed for enhanced performance. It sits above entry-level models in terms of logic capacity and processor integration. The -1 speed grade indicates standard timing characteristics suitable for general high-performance applications within the industrial temperature range.
Direct pin-to-pin replacements within the same package may include other speed grades of the XCZU7EV series, such as -2 or -3, provided timing closure is verified. Cross-family migration requires schematic and firmware re-evaluation.