XCZU7EV-2FBVB900E

Overview

The AMD XCZU7EV-2FBVB900E is a Zynq UltraScale+ MPSoC System-on-Chip FPGA in a 900-ball FCBGA package. It integrates a quad-core ARM Cortex-A53 processor, dual-core ARM Cortex-R5 processor, and Mali-400 MP2 GPU. The device features 28,800 Adaptive Logic Modules (ALMs), 11 Mbit of embedded memory, and supports up to 220 I/Os. Operating at speed grade -2 with a maximum junction temperature of +100°C, it utilizes an 850 mV core voltage for high-performance embedded applications requiring mixed processing and programmable logic.

Feature Summary

• Integrated heterogeneous processing system with quad-core ARM Cortex-A53, dual-core ARM Cortex-R5, and Mali-400 MP2 GPU
• Fabric resource density of 28,800 ALMs and 11 Mbit embedded memory for complex logic implementation
• Supports high-speed interfaces including PCIe, USB 3.0, and Gigabit Ethernet via dedicated hard processors
• Industrial temperature range operation from 0°C to +100°C with 900-ball FCBGA packaging

Applications

• Industrial automation and control systems
• Medical imaging equipment
• Test and measurement instrumentation
• Automotive infotainment and advanced driver assistance systems

Procurement Notes

Verify the specific speed grade suffix (-2) against project timing requirements, as performance differs from -1 or -3 variants. Confirm RoHS compliance status and moisture sensitivity level (MSL) ratings prior to assembly planning. Ensure availability of compatible development boards and software licenses for the Zynq UltraScale+ MPSoC platform.

Selection Notes

Select this model when a balance of moderate FPGA fabric size and robust application processor performance is required. Compare against the XCZU7EV-1 variant if higher clock frequencies are needed, or the XCZU4EG series if lower power consumption and reduced logic resources suffice. Validate that the 900-ball BGA footprint fits the target PCB design constraints.

Part Context

This component belongs to the Zynq UltraScale+ MPSoC EV family, designed for cost-sensitive embedded markets. It shares the same silicon architecture as other EV devices but varies by speed bin and package. The part number indicates the specific electrical characteristics and thermal performance envelope defined by AMD for mass production.

Replacement Considerations

Direct pin-to-pin replacements within the same package include other speed grades of the XCZU7EV series, such as XCZU7EV-1FBVB900E or XCZU7EV-3FBVB900E, provided timing closure can be met. Cross-family replacements like the XCZU5CG require significant schematic and layout modifications.