XCZU9EG-1FFVC900E

XCZU9EG-1FFVC900E

$2,684.94
  • Description:IC SOC CORTEX-A53 900FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EG

SKU:3699a2a1dc66 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC SOC CORTEX-A53 900FCBGA
  • Series:Zynq® UltraScale+™ MPSoC EG
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:500MHz, 600MHz, 1.2GHz
  • Primary Attributes:Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:900-BBGA, FCBGA
  • Supplier Device Package:900-FCBGA (31x31)

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XCZU9EG-1FFVC900E

Overview

The AMD XCZU9EG-1FFVC900E is a System on Chip (SoC) FPGA from the Zynq UltraScale+ MPSOC EG series. It integrates a quad-core ARM Cortex-A53 MPCore with CoreSight, dual ARM Cortex-R5 processors with CoreSight, and an ARM Mali-400 MP2 GPU. The programmable logic section contains over 599K logic cells. Key electrical parameters include maximum clock frequencies of 500 MHz for the A53 cores, 600 MHz for the R5 cores, and 1.2 GHz for the FPGA fabric. The device operates at a core voltage of 850 mV within a temperature range of 0°C to 100°C TJ.

Feature Summary

  • Integrated heterogeneous processing system featuring Quad ARM Cortex-A53, Dual ARM Cortex-R5, and ARM Mali-400 MP2.
  • Programmable Logic with 599K+ Adaptive Logic Modules (ALMs) and 32.1 Mbit embedded memory.
  • Supports multiple connectivity protocols including Ethernet, USB OTG, SPI, I2C, UART, and CANbus.
  • Available in a 900-ball FCBGA package (31x31 mm) suitable for surface mount applications.

Applications

  • Industrial automation and control systems requiring real-time processing.
  • Medical imaging devices utilizing high-performance SoC capabilities.
  • Test and measurement equipment needing flexible I/O and signal processing.
  • Video surveillance and analytics platforms leveraging integrated AI acceleration.

Procurement Notes

Verify component authenticity through authorized AMD distributors or certified partners. Confirm the specific suffix 'E' denotes the extended commercial temperature range (0°C to 100°C TJ). Ensure compliance with RoHS directives and check for moisture sensitivity labeling prior to soldering. Lead times and availability should be confirmed directly with suppliers as they fluctuate based on production schedules.

Selection Notes

Select this model when a balance of processing power and programmability is required for commercial-grade applications. The XCZU9EG variant offers higher performance than standard CG parts but may have different thermal or pinout characteristics compared to larger packages like FFVB1156. Evaluate if the 599K ALM count and 204 I/O pins meet the specific interface requirements of the target design.

Part Context

This component belongs to the Zynq UltraScale+ MPSOC family, which merges ARM processor subsystems with Xilinx FPGA technology. The 'EG' suffix typically indicates enhanced performance or specific feature sets within the XCZU9CG/EG product line. It serves as a central processing unit for complex embedded systems requiring both deterministic hardware logic and general-purpose computing.

Replacement Considerations

Direct functional replacements within the same package are limited due to unique pinouts. Consider the XCZU9CG-1FFVC900I for similar logic density but verify differences in processor configurations and temperature ratings. Larger packages such as XCZU9EG-L1FFVB1156I offer more I/O but require significant board redesign.

XCZU9EG-1FFVC900EXCZU9EG-1FFVC900E
$2,684.94
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