XPC823ECZT66BA

XPC823ECZT66BA

$16.11
  • Description:IC MPU 66MHZ 256BGA
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tray

SKU:7c15a6f20549 Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:IC MPU 66MHZ 256BGA
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tray
  • Core Processor:PowerPC
  • Number of Cores/Bus Width:1 Core, 32-Bit
  • Speed:66MHz
  • Co-Processors/DSP:Communications; RISC CPM
  • RAM Controllers:-
  • Graphics Acceleration:No
  • Display & Interface Controllers:LCD, Video
  • Ethernet:10Mbps (1)
  • SATA:-
  • USB:USB 1.x (1)
  • Voltage - I/O:3.3V
  • Operating Temperature:-40°C ~ 95°C (TJ)
  • Security Features:-
  • Mounting Type:Surface Mount
  • Package / Case:256-BBGA
  • Supplier Device Package:256-PBGA (23x23)
  • Additional Interfaces:I2C, SMC, SCC, SPI, UART
  • Grade:-
  • Qualification:-

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XPC823ECZT66BA

Overview

The XPC823ECZT66BA is a PowerQUICC Integrated Communications Processor designed for portable systems. It integrates a Power Architecture core with a Communications Processor Module (CPM) to handle low-level peripheral tasks, allowing the main core to manage high-level processing. This dual-core architecture optimizes performance and power efficiency for networking and communications applications in mobile environments.

Feature Summary

  • Integrates a Power Architecture embedded core with a RISC-based Communications Processor Module for balanced task distribution
  • Supports multiple communication protocols including Fast Ethernet MAC, ATM, HDLC, PCI, and USB interfaces
  • Features on-chip hardware security engines supporting DES, 3DES, MD-5, SHA-1, AES, and ARC-4 encryption algorithms

Applications

  • Small and medium enterprise routers
  • Virtual private network equipment
  • Wireless access points
  • Residential gateways
  • xDSL equipment

Procurement Notes

Verify component authenticity through authorized NXP distributors or direct manufacturer channels. Confirm package integrity and pin alignment against datasheet specifications. Ensure storage conditions comply with moisture sensitivity level requirements to prevent soldering defects during assembly.

Selection Notes

Select this processor for designs requiring integrated hardware security and protocol offloading in portable devices. Evaluate thermal management capabilities due to the BGA packaging. Consider the availability of development tools and software support for the Power Architecture core and CPM integration.

Part Context

This component belongs to the MPC8272 PowerQUICC II family, which addresses cost-sensitive networking needs. The family includes variants like MPC8247, MPC8248, MPC8271, and MPC8272, all sharing the dual-core architecture and security features tailored for embedded communications.

Replacement Considerations

Check for updated revisions within the MPC82xx series that maintain pin compatibility. Verify if newer PowerQUICC models offer enhanced security algorithms or higher interface speeds suitable for modern network standards.

XPC823ECZT66BAXPC823ECZT66BA
$16.11
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