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The XPC823EVR66B2 is a mobile computing microprocessor from the MPC823 family, featuring an embedded PowerPC core and a Communication Processor Module (CPM). It operates at 66 MHz within a 0°C to 95°C temperature range. The device utilizes a 256-lead Plastic Ball Grid Array (PBGA) package with a 17x17 mm footprint and 1.00 mm pitch. Key specifications include a 32-bit architecture, 1K data cache, 2K instruction cache, and support for multiple memory interfaces including DRAM, SRAM, and Flash.
Verify component authenticity through authorized NXP or Freescale distributors. Confirm package integrity and pin alignment against the 256-lead PBGA specification. Ensure environmental compliance documentation matches the specific lot code. Validate operating temperature range requirements against the commercial grade designation. Cross-reference ordering suffixes with official datasheets to confirm frequency and package variations.
Select this component for designs requiring a balance of general-purpose processing and dedicated communication handling. The integrated CPM offloads serial protocol processing from the main core. Consider the available cache sizes and memory controller flexibility for system integration. Evaluate power consumption profiles across different operational modes for battery-operated constraints. Verify peripheral compatibility with existing display and storage interfaces.
This part belongs to the MPC823 Mobile Computing Microprocessor family, originally developed by Motorola and later acquired by Freescale Semiconductor, now NXP. The MPC823 series targets the embedded market with a focus on low-power, high-integration solutions for portable devices. It represents a transition point in the PowerQUICC lineage, emphasizing multimedia and communication capabilities alongside standard RISC processing.
Consult official NXP/Freescale obsolescence notices for direct replacements. The XPC823EVR75B2 offers identical functionality at a higher 75 MHz clock speed within the same package. Other MPC823 variants may differ in temperature ratings or package dimensions. No cross-family migration is guaranteed without schematic and software verification.