XPC823EZT66BA

Overview

The XPC823EZT66BA is a PowerPC-based microprocessor unit manufactured by NXP USA Inc. It features a single 32-bit core operating at a clock frequency of 66 MHz. The device is housed in a 256-ball ball grid array (BGA) package with dimensions of 23x23 mm. Designed for embedded portable systems, it supports industrial temperature ranges from 0°C to 95°C.

Feature Summary

• PowerPC architecture implementation
• Single-core 32-bit processing capability
• Integrated BGA packaging solution

Applications

• Portable system microprocessors
• Embedded control units
• Industrial computing modules

Procurement Notes

Verify the complete part number including suffixes against official NXP documentation to ensure correct package and temperature grade. Confirm datasheet revisions match your design requirements. Check for RoHS compliance status in the specific manufacturing batch documentation before integration into final assemblies.

Selection Notes

Select this component when a dedicated PowerPC core is required for portable embedded applications. Ensure the 66 MHz performance meets system timing constraints. Verify that the 256-pin BGA footprint aligns with PCB layout capabilities and thermal management strategies for the target enclosure environment.

Part Context

This component belongs to the NXP MPC823 family of PowerPC microprocessors. These devices are engineered for high-performance embedded applications requiring efficient code execution and low power consumption. The series supports various peripheral interfaces suitable for communication and control tasks in compact form factors.

Replacement Considerations

Consult NXP official substitution guides for compatible alternatives within the MPC823 series. Verify pin compatibility and electrical specifications before swapping components. Cross-reference package dimensions to ensure mechanical fit without redesigning the carrier board.