XPC8255CZUIFBC

XPC8255CZUIFBC

$155.80
  • Description:IC MPU MPC82XX 200MHZ 480TBGA
  • Series:MPC82xx
  • Mfr:Freescale Semiconductor
  • Package:Tray

SKU:1700ec521959 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC MPU MPC82XX 200MHZ 480TBGA
  • Series:MPC82xx
  • Mfr:Freescale Semiconductor
  • Package:Tray
  • Core Processor:PowerPC G2
  • Number of Cores/Bus Width:1 Core, 32-Bit
  • Speed:200MHz
  • Co-Processors/DSP:Communications; RISC CPM
  • RAM Controllers:DRAM, SDRAM
  • Graphics Acceleration:No
  • Display & Interface Controllers:-
  • Ethernet:10/100Mbps (3)
  • SATA:-
  • USB:-
  • Voltage - I/O:3.3V
  • Operating Temperature:-40°C ~ 105°C (TA)
  • Security Features:-
  • Mounting Type:Surface Mount
  • Package / Case:480-LBGA Exposed Pad
  • Supplier Device Package:480-TBGA (37.5x37.5)
  • Additional Interfaces:I2C, SCC, SMC, SPI, UART, USART

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XPC8255CZUIFBC

Overview

The XPC8255CZUIFBC is a PowerPC G2 microprocessor belonging to the MPC82xx family, manufactured by NXP USA Inc. It features a single 32-bit core operating at a speed of 200MHz. The device is housed in a 480-LBGA package with an exposed pad, specifically identified as a 480-TBGA (37.5x37.5) supplier device package. It supports I/O voltages of 3.3V and operates within a temperature range of -40°C to 105°C (TA). Key integrated peripherals include three 10/100Mbps Ethernet controllers, DRAM and SDRAM memory controllers, and a Communications Processor Module (CPM). Additional interfaces encompass I2C, SCC, SMC, SPI, UART, and USART.

Feature Summary

  • Integrates a PowerPC G2 core with a dedicated Communications Processor Module for handling communication protocols.
  • Includes multiple high-speed serial communication interfaces such as SPI, UART, and USART alongside I2C support.
  • Features built-in memory controllers compatible with both DRAM and SDRAM technologies.

Applications

  • Networking infrastructure equipment requiring integrated Ethernet connectivity
  • Telecommunications systems utilizing PowerQUICC II architecture
  • Industrial control applications necessitating wide operating temperature ranges

Procurement Notes

Verify component authenticity through official manufacturer channels or authorized distributors. Confirm that the specific suffix matches the required package and temperature grade. Check for RoHS compliance status and ensure the obsolete part status aligns with long-term availability requirements. Validate datasheet revisions against current design specifications before procurement.

Selection Notes

Select this component when a PowerPC G2 architecture is required for embedded processing tasks. Ensure the design accommodates the 480-pin TBGA footprint and 3.3V I/O levels. Consider the 200MHz clock speed and CPM capabilities for protocol offloading needs. Verify thermal management solutions for the specified operating temperature range.

Part Context

This microprocessor is part of the broader MPC82xx series, which includes variants like the MPC8260 and MPC8265. These devices are designed for communications processors, combining RISC processing power with specialized hardware accelerators. The family targets networking and telecommunications markets, offering integrated peripheral sets to reduce system complexity.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Consult NXP technical support for legacy replacement strategies given the obsolete status.

XPC8255CZUIFBCXPC8255CZUIFBC
$155.80
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