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The XPC850ZT50BU is a microprocessor IC from the MPC8xx series, manufactured by NXP USA Inc. It features a single 32-bit core operating at a speed of 50MHz. The component is housed in a 256-PBGA package with dimensions of 23x23 mm. It supports DRAM controllers and operates within an ambient temperature range of 0°C to 95°C. The I/O voltage is specified at 3.3V, and it utilizes surface mount mounting technology.
Verify the specific suffix 'BU' against official NXP documentation to confirm package type and temperature grade. Ensure compatibility with 3.3V I/O levels in the target circuit design. Cross-reference the base part number PC850 for pinout consistency. Confirm that the 256-BGA footprint matches the PCB layout specifications before procurement.
Select this component when a 32-bit RISC architecture is required for communications processing. The 50MHz clock speed suits moderate-performance embedded applications. Consider the 256-pin BGA package constraints for board space and thermal management. Verify support for required peripheral interfaces such as USB 1.x or serial ports during the initial design phase.
This device belongs to the MPC8xx family of microprocessors, originally developed by Motorola and now managed by NXP Semiconductors. The MPC8xx series is widely recognized for its use in networking and telecommunications equipment. The XPC850 variant specifically targets cost-sensitive applications requiring robust processing power and integrated peripherals.
Consult official substitution lists for compatible MPC8xx variants. Verify electrical and pinout compatibility before replacing with similar models.