ZL50111GAG2

Overview

The ZL50111GAG2 is a Circuit Emulation Services over Packet (CESoP) processor manufactured by Microchip Technology. It supports 256 channels of TDM traffic and operates within a supply voltage range of 1.65V to 1.95V, with a maximum supply current of 950mA. The device utilizes a 552-ball PBGA package measuring 35x35 mm and is rated for an industrial operating temperature range of -40°C to +85°C. Designed for telecom interface applications, it integrates on-chip timing and synchronization recovery capabilities across packet networks.

Feature Summary

• Supports Circuit Emulation Services over Packet (CESoP) transport for MPLS, IP, and Ethernet networks
• Provides on-chip timing and synchronization recovery across packet networks
• Offers grooming capability for Nx64 Kbps trunking

Applications

• Circuit Emulation Services over Packet (CESoP) transport in MPLS networks
• Circuit Emulation Services over Packet (CESoP) transport in IP networks
• Circuit Emulation Services over Packet (CESoP) transport in Ethernet networks

Procurement Notes

Verify the specific revision level and manufacturing date code against the official Microchip datasheet before integration. Confirm that the 552-BGA footprint matches the target PCB design constraints. Ensure compliance with RoHS directives as specified in the product documentation. Check for any end-of-life notifications or discontinuance alerts from the manufacturer prior to finalizing procurement plans.

Selection Notes

Select this component when 256-channel CESoP processing is required for telecom infrastructure. Compare against the ZL50110, ZL50112, and ZL50114 variants based on specific channel count requirements. Verify that the 1.65V to 1.95V power domain aligns with the system's voltage regulation architecture. Ensure the 552-PBGA package size fits within the available board real estate.

Part Context

This part belongs to the ZL5011x family of CESoP processors, which includes models supporting 128, 256, 512, and 1024 channels. These devices are designed for high-density telecom applications requiring efficient TDM-to-packet conversion. The GAG2 suffix typically denotes a specific package type and lead-free composition standard defined by Microchip.

Replacement Considerations

Direct functional substitutes within the same family include the ZL50110GAG2 (128 channels), ZL50112GAG2 (512 channels), and ZL50114GAG2 (1024 channels). Selection depends on whether channel capacity needs reduction or expansion. Verify pin compatibility and software configuration differences between these variants.