ZSC31015EIC

Overview

The ZSC31015EIC is a sensor interface integrated circuit manufactured by Renesas Electronics Corporation. It is classified as a dice (wafer sawn) component supplied in a frame configuration, intended for surface-mount assembly. The device functions as a sensor signal conditioner within the ZSC31015 series. Standard manufacturing packaging quantities are listed at 6,200 units per tray. The product status is active and currently in production.

Feature Summary

• Provides sensor signal conditioning capabilities
• Designed for integration into sensor interface applications

Applications

• Sensor interface systems requiring signal conditioning
• Industrial sensor modules
• Automotive sensor assemblies

Procurement Notes

Verify the specific package type and handling requirements for wafer-sawn dice components before procurement. Confirm that the frame-supplied format aligns with your assembly line capabilities. Check current availability status as supply may be limited or subject to allocation. Ensure compliance with moisture sensitivity levels during storage and reflow processes.

Selection Notes

Select this part when a bare die solution in a frame is required for custom packaging or high-volume integration. Compare against SOP-8 packaged variants like the ZSC31015EIG1-R if standard surface-mount assembly is preferred. Evaluate thermal management needs specific to exposed die configurations.

Part Context

This component belongs to the ZSC31015 family of sensor signal conditioners from Renesas Electronics. While other variants in the series offer SOP-8 packages, the EIC suffix specifically denotes the wafer-sawn dice form factor. This configuration supports flexible system-in-package implementations.