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Product Detailed Parameters
- Description：DICE (WAFER SAWN) - FRAME
- Series：-
- Mfr：Renesas Electronics Corporation
- Package：Tray
- Type：-
- Input Type：-
- Output Type：-
- Current - Supply：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Grade：-
- Qualification：-
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Overview
The ZSSC3215CI1C is a sensor interface integrated circuit manufactured by Renesas Electronics. It is classified under Sensor Interface ICs and belongs to the ZSSC3215 series. The component is supplied as a die on a frame, intended for surface mount or direct chip-on-board assembly. It operates within a standard industrial temperature range and supports I2C and UART communication interfaces. The device accepts dual bridge inputs and functions with supply voltages ranging from 1.8 V to 5.5 V. It draws approximately 8 mA of operating current and features an input bias current of 500 uA.
Feature Summary
- Provides signal conditioning for resistive bridge sensors
- Supports flexible digital communication via I2C and UART
- Designed for high-density chip-on-board integration
Applications
- IoT sensor node signal processing
- Industrial measurement systems
- Smart home sensor interfaces
Procurement Notes
Verify the specific die configuration and frame attachment requirements before procurement. Confirm that the design accommodates bare die handling and mounting processes. Ensure compatibility with the required voltage levels and communication protocols. Check for any specific RoHS compliance documentation if mandated by the target market regulations.
Selection Notes
Select this component when a compact sensor interface solution is required for bridge-type sensors. Consider the die form factor for space-constrained designs requiring direct board integration. Verify that the dual bridge input capability matches the sensor architecture. Ensure the system can support the necessary calibration coefficients stored in non-volatile memory.
Part Context
This part is part of the ZSSC3215 family of sensor signal conditioners. It complements Renesas' broader portfolio of MCUs and embedded AI solutions for IoT applications. The device is designed to simplify sensor integration by providing amplification, digitization, and correction capabilities in a small footprint.
Replacement Considerations
Check for other members of the ZSSC32xx series with similar interface options. Verify pinout and functional compatibility if substituting with other Renesas sensor interface dies. Ensure the replacement supports the same dual bridge input requirement.
