ZSSC3230BC5B

ZSSC3230BC5B

$1.02
  • Description:WAFER UNSAWN, 304U, WITH INKING
  • Series:-

SKU:8d08e82f1a3c Category: Brand:

  
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Product Detailed Parameters

  • Description:WAFER UNSAWN, 304U, WITH INKING
  • Series:-
  • Mfr:Renesas Electronics Corporation
  • Package:Tray
  • Type:Capacitive Sensor
  • Input Type:Analog, Digital
  • Output Type:I2C, Serial
  • Current - Supply:1.1 mA
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:Die
  • Supplier Device Package:Die
  • Grade:-
  • Qualification:-

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ZSSC3230BC5B

Overview

The ZSSC3230BC5B is a capacitive sensor signal conditioning integrated circuit manufactured by Renesas Electronics. It belongs to the ZSSC3230 series and is designed for battery-driven low-power applications, achieving an average power consumption of 1.3µA at a 1Hz conversion rate. The component integrates a high-precision capacitive analog front end with low-power technology. It is supplied as an unsawn wafer in a gel pack, intended for surface mount device (SMD/SMT) installation. The part falls under the Sensor Interface product category and Interface ICs sub-category.

Feature Summary

  • Combines low-power technology with a high-precision capacitive analog front end
  • Optimized for battery-driven applications requiring minimal energy usage
  • Provides signal conditioning capabilities for capacitive sensors

Applications

  • Battery-powered sensing systems
  • Low-power capacitive sensor interfaces
  • Data-driven sensing technologies

Procurement Notes

Verify the specific suffix BC5B against official Renesas documentation to confirm it denotes an unsawn wafer configuration rather than a standard packaged die. Confirm that the gel pack packaging aligns with your manufacturing handling requirements. Ensure compatibility with your SMD/SMT assembly processes for bare die or wafer-level integration. Cross-reference the RoHS status details provided in the manufacturer's datasheet to meet regulatory compliance standards.

Selection Notes

Select this component when designing systems that require ultra-low average current consumption, specifically around 1.3µA at 1Hz. It is suitable for applications utilizing capacitive sensing mechanisms where high precision is required alongside extended battery life. Consider the unsawn wafer form factor if your production line supports direct wafer-level processing or specialized die attachment methods.

Part Context

This part is a variant within the ZSSC3230 family of sensor signal conditioning ICs. Other variants like ZSSC3230BI1B share similar core functionalities but may differ in packaging or specific wafer configurations. The series is positioned to offer best-in-class performance for sensing technologies by merging precision analog front ends with efficient power management architectures.

Replacement Considerations

Consult the official Renesas ZSSC3230 datasheet for confirmed substitute part numbers. Verify functional equivalence regarding the capacitive analog front end and power consumption metrics before considering alternatives.

ZSSC3230BC5BZSSC3230BC5B
$1.02
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