ZSSC3230BI1DES

ZSSC3230BI1DES

$3.36
  • Description:DICE (WAFER SAWN) - WAFFLE PACK
  • Series:-

SKU:bd79ae0604a2 Category: Brand:

  
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Product Detailed Parameters

  • Description:DICE (WAFER SAWN) - WAFFLE PACK
  • Series:-
  • Mfr:Renesas Electronics Corporation
  • Package:Tray
  • Type:Capacitive Sensor
  • Input Type:Analog, Digital
  • Output Type:I2C, Serial
  • Current - Supply:1.1 mA
  • Operating Temperature:-40°C ~ 125°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:Die
  • Supplier Device Package:Die
  • Grade:-
  • Qualification:-

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ZSSC3230BI1DES

Overview

The ZSSC3230BI1DES is a capacitive sensor signal conditioning IC from Renesas Electronics, designed for battery-driven low-power applications. It integrates a high-precision capacitive analog front end with low-power technology to achieve an average current consumption of 1.3µA at a 1Hz conversion rate. The device supports operation with supply voltages of 1.8V or 3.3V and features a die package configuration suitable for surface mount installation.

Feature Summary

  • Combines high-precision capacitive sensing with ultra-low power consumption capabilities
  • Supports flexible communication interfaces including I2C connectivity
  • Enables direct connection to capacitive sensors or simulation via on-board components

Applications

  • Battery-powered wireless motion detectors
  • Smart metering systems requiring tamper detection
  • Industrial multi-sensor platforms integrating ASi-5 protocols

Procurement Notes

Verify the specific suffix designation against official Renesas documentation to confirm exact electrical characteristics and packaging specifications. Ensure compatibility with existing system voltage rails and interface requirements before integration into final designs.

Selection Notes

Select this component for designs prioritizing minimal standby current in portable devices. Confirm that the required sampling rate aligns with the 1Hz baseline performance metrics. Validate that the die package format matches the intended PCB assembly process and thermal management strategy.

Part Context

This part belongs to the ZSSC3230 series of sensor signal conditioners. It complements evaluation kits like the ZSSC3230KIT for development purposes. The series targets applications needing precise capacitive measurement with strict power constraints.

Replacement Considerations

Consult official Renesas discontinuation notices for legacy variants such as the ZSSC3230AC3V ES. Verify functional equivalence and pinout compatibility when substituting older generation parts in existing hardware architectures.

ZSSC3230BI1DESZSSC3230BI1DES
$3.36
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