ZSSC4161DE1C-APB

$1.66

Description：TESTED DIE, SAWN ON FOIL -CFG 41
Series：-

SKU:38914c7a42d9 Category: Sensor and Detector Interfaces Brand: Renesas Electronics Corporation

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Product introduction

Product Detailed Parameters

Description：TESTED DIE, SAWN ON FOIL -CFG 41
Series：-
Mfr：Renesas Electronics Corporation
Package：Tape & Reel (TR)
Type：-
Input Type：-
Output Type：-
Current - Supply：-
Operating Temperature：-
Mounting Type：-
Package / Case：-
Supplier Device Package：-
Grade：-
Qualification：-

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ZSSC4161DE1C-APB

Overview

The ZSSC4161DE1C-APB is an automotive-grade sensor interface component from Renesas Electronics, belonging to the ZSSC416x family. It is a tested die sawn on foil designed for precise amplification and correction of Wheatstone bridge sensor signals. The device supports I2C and serial interfaces with a supply voltage range of 4.75 V to 5.25 V. It operates within a temperature range of -40°C to +150°C and features differential input types including thermocouple and voltage inputs.

Feature Summary

Provides high-performance CMOS integration for accurate signal amplification and digital compensation of offset and gain errors in Wheatstone bridge sensors.
Supports multiple interface protocols including I2C and serial communication for flexible system integration.
Engineered for automotive applications with extended operating temperature capabilities up to +150°C.

Applications

Automotive pressure sensing systems
Industrial sensor signal conditioning
High-accuracy measurement instrumentation

Procurement Notes

Verify that the specific suffix APB corresponds to the tested die sawn on foil configuration as documented in official Renesas datasheets. Confirm compatibility with the ZSSC4169kitv1.4 development environment if applicable. Ensure sourcing channels provide authentic components matching the manufacturer's specifications for automotive grade reliability.

Selection Notes

Select this component when a bare die solution is required for custom packaging or advanced substrate integration. Consider the ZSSC4161DE4R variant if tape and reel packaging is preferred over sawn foil. Evaluate thermal management requirements given the high maximum operating temperature specification.

Part Context

This part belongs to the ZSSC416x/ZSSC417x series of sensor interface ICs. It shares functional similarities with the ZSSC4161DE4R but differs in physical packaging format. The DE1C designation indicates a specific die configuration distinct from standard packaged QFN variants.