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The ZXCD1000EQ16TC is a Class D audio amplifier controller IC from Diodes Incorporated, housed in a 16-pin exposed pad QSOP package. It operates within a VCC range of 12V to 18V with a typical quiescent current of 45mA at 12V and 50mA at 18V. The internal oscillator frequency is set by an external capacitor (Cosc = 330pF) to a nominal 200kHz with a tolerance of +/-25%. The device provides high gate drive capability for up to 2200pF loads, featuring output drive rise/fall times of 50ns. Internal regulators supply 9VA/9VB rails (nominal 8.75V) and a 5V5 rail (nominal 5.5V).
Verify the specific suffix 'EQ16TC' against the manufacturer's official ordering information to confirm tape and reel packaging details and temperature grade. Ensure compatibility with the required 16-pin exposed pad QSOP footprint on the PCB layout. Cross-reference the datasheet revision date to confirm all electrical characteristics remain unchanged.
Select this component when designing high-efficiency Class D amplifiers requiring low distortion and absence of crossover artifacts. It is suitable for mono or synchronized stereo configurations driving external MOSFET bridges. Consider the maximum VCC limit of 18V for the controller itself, even if higher system voltages are used for the output stage.
This part belongs to the ZXCD series of Class D audio amplifier controllers manufactured by Diodes Incorporated (formerly Zetex). The series is designed to work with external HDMOS devices to create complete audio solutions. The ZXCD1000 specifically targets high-performance applications where linearity and efficiency are critical.
Public confirmed substitute part numbers are not available in the provided documentation.
The switching frequency is set by an external timing capacitor connected to the Cosc pin. With a standard 330pF capacitor, the nominal frequency is approximately 200kHz.
Yes, two units can be synchronized to prevent audible beat frequencies. This is achieved by connecting the triangle wave output of one unit to the input of the other.
The exposed pad on the underside of the QSOP package should be soldered to a copper area on the PCB to function as a heatsink for thermal management.