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Product Detailed Parameters
- Description：RF DIODE PIN 50V 100MW 3MCP
- Series：-
- Mfr：onsemi
- Package：Tape & Reel (TR),Bulk
- Diode Type：PIN - 1 Pair Series Connection
- Voltage - Peak Reverse (Max)：50V
- Current - Max：50 mA
- Capacitance @ Vr, F：0.23pF @ 50V, 1MHz
- Resistance @ If, F：9Ohm @ 10mA, 100MHz
- Power Dissipation (Max)：100 mW
- Operating Temperature：125°C (TJ)
- Package / Case：SC-70, SOT-323
- Supplier Device Package：3-MCP
- Grade：-
- Qualification：-
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Overview
The 1SV315-TL-E is a dual series PIN diode manufactured by onsemi, designed for VHF and UHF applications. It operates with a maximum reverse voltage of 50V and a forward current of 50mA. The device features an ultrasmall MCP package (SOT-323) to facilitate high-density mounting. Key electrical characteristics include a typical interterminal capacitance of 0.23pF at 50V reverse bias and a typical series resistance of 6Ω at 10mA forward current. The component is supplied in tape and reel packaging with a minimum quantity of 3,000 units per reel.
Feature Summary
- Dual series configuration within a single ultrasmall package
- Low interterminal capacitance suitable for high-frequency circuits
- Small physical footprint enabling compact equipment design
Applications
- VHF and UHF frequency circuits
- Automatic Gain Control (AGC) systems
- RF switching applications
Procurement Notes
Verify the specific ordering suffix TL-E to confirm the tape and reel shipping format containing 3,000 pieces per reel. Ensure the procurement matches the Pb Free designation and the MCP package type. Confirm that the requested quantity aligns with the manufacturer's standard packing requirements for this surface-mount component.
Selection Notes
Select this component when a dual PIN diode structure is required for VHF or UHF signal processing. The low capacitance value makes it appropriate for high-frequency attenuation or switching tasks. Verify that the 50V reverse voltage rating meets the circuit's peak inverse voltage requirements and that the small SOT-323 package fits the available board space constraints.
Part Context
This part belongs to the 1SV315 family of dual series PIN diodes produced by onsemi. The TL-E suffix specifically denotes the embossed taping specification used for automated surface-mount assembly. The device utilizes an MCP package form factor equivalent to the SC-70 or SOT-323 standard.
Replacement Considerations
Direct substitutes must match the dual series PIN diode topology and the MCP/SOT-323 package outline. Verify that alternative components provide comparable interterminal capacitance and series resistance values at similar operating frequencies to maintain circuit performance integrity.
