2N6032

Overview

The Harris Corporation 2N6032 is a silicon NPN power bipolar junction transistor designed for high-current switching applications. It features a collector-emitter breakdown voltage of 90V and supports a maximum continuous collector current of 50A. The device is housed in a hermetically sealed metal TO-3 (TO-204AA) package with a flange mount configuration, where the case is electrically connected to the collector. This construction ensures robust thermal dissipation and reliability in demanding environments.

Feature Summary

• Hermetically sealed metal TO-3 package for environmental protection
• High current handling capability up to 50A
• Collector-connected flange mount for efficient heat dissipation

Applications

• High-power switching circuits
• Industrial motor control systems
• Power supply output stages

Procurement Notes

Verify the specific manufacturer origin, as the 2N6032 specification has been produced by multiple vendors including Semelab and Microchip/Microsemi. Confirm that the received component matches the required hermetic sealing standards and pinout configuration for the TO-3 package before integration into critical designs.

Selection Notes

Select this component when designing circuits requiring high current capacity and robust thermal management. The TO-3 metal package is suitable for applications where superior heat sinking is necessary. Ensure the design accounts for the collector-to-case electrical connection inherent in this package style.

Part Context

This part belongs to the family of high-power NPN silicon transistors utilizing the legacy TO-3 metal can package. It serves as a rugged alternative to plastic-packaged equivalents, offering enhanced durability and thermal performance for industrial and military-grade electronics requiring reliable high-current switching.

Replacement Considerations

Direct substitutes include the 2N6032R1 from Semelab, which shares identical electrical ratings and hermetic TO-3 packaging. Other manufacturers such as Microchip may offer equivalent specifications under different suffixes; verify pinout compatibility and thermal resistance values before substitution.