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2PB709ART-QR is listed in the Single Bipolar Transistors range at ChipApex. The manufacturer field lists Nexperia USA Inc.. Its product description is 2PB709ART-Q/SOT23/TO-236AB. Review the specifications below when checking this part for your BOM.
The Nexperia 2PB709ART-QR is a PNP bipolar junction transistor (BJT) designed for general-purpose switching and amplification applications. It is housed in an SOT-23 surface-mount package, providing a compact footprint suitable for space-constrained designs. The device features a maximum collector-emitter voltage (VCEO) of 45 V and a continuous collector current rating of 100 mA. With a power dissipation capability of 250 mW and a transition frequency (fT) of 70 MHz, it supports efficient signal processing. The component operates reliably within an extended temperature range from -65 °C to +150 °C.
Verify the specific suffix 'QR' against the official Nexperia datasheet to confirm reel specifications and tape-and-reel dimensions. Ensure the ordering part number matches the required automotive grade designation. Cross-reference the manufacturer's latest product change notifications to confirm material composition and manufacturing location stability before finalizing procurement contracts.
Select this component when a PNP transistor with 45 V breakdown and 100 mA current capacity is required in an SOT-23 package. Consider the 70 MHz transition frequency for moderate-speed switching needs. Verify that the thermal management strategy accommodates the 250 mW power dissipation limit in the intended enclosure environment.
This part belongs to Nexperia's portfolio of AEC-Q101 qualified discrete semiconductors. The 'Q' suffix typically denotes automotive-grade reliability and compliance with stringent quality standards. It serves as a complement to NPN counterparts like the BCX70G in push-pull or differential amplifier configurations.
Check for direct pin-compatible alternatives such as the 2PB709ASL variant. Verify electrical parameter equivalence, particularly VCEO and hFE ranges, before substitution. Confirm package compatibility and thermal characteristics match the original design requirements.
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