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2SB1243TV2P is listed in the Single Bipolar Transistors range at ChipApex. The manufacturer field lists Rohm Semiconductor. Its product description is TRANS PNP 50V 3A ATV. Review the specifications below when checking this part for your BOM.
The ROHM 2SB1243TV2P is a PNP silicon epitaxial planar power transistor rated for -60V collector-base voltage and -50V collector-emitter breakdown. It supports a continuous collector current of -3A with a maximum power dissipation of 1W at 25°C ambient temperature, or up to 15W on a printed circuit board with adequate copper plating. The device features a low collector-emitter saturation voltage of -0.5V typical at -2A/-0.2A drive conditions. It includes an hFE classification system (Q: 120-270, R: 180-390) and utilizes the ATV package code.
Verify the ordering suffix TV2P against official ROHM documentation to confirm the specific taping quantity and packaging format. Ensure the required hFE bin (Q or R) is specified during procurement, as gain values are classified into distinct ranges. Confirm that the application environment remains within the prescribed absolute maximum ratings for junction temperature and power dissipation.
Select this component when a PNP power transistor with -60V/ -3A capability is required for general-use electronics. Consider the ATV package dimensions for PCB layout compatibility. Evaluate the hFE classification requirements based on base drive current availability. Verify that the operating temperature range falls within the specified -55°C to 150°C storage limits.
The 2SB1243 belongs to a family of medium-power PNP transistors manufactured by ROHM Semiconductor. It shares electrical characteristics and physical dimensions with the 2SB1184 model, differing primarily in packaging configuration. This series is designed for standard commercial applications rather than automotive or radiation-tolerant environments.
The 2SB1184 serves as a direct functional substitute with identical electrical ratings and pinout configurations. Designers should verify that the replacement part's packaging matches the existing footprint constraints.
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