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2SD2144STPV is listed in the Single Bipolar Transistors range at ChipApex. The manufacturer field lists Rohm Semiconductor. Its product description is TRANS NPN 20V 0.5A SPT. Review the specifications below when checking this part for your BOM.
The 2SD2144STPV is an NPN silicon epitaxial planar transistor in a through-hole SPT (SC-72) package. It features a collector-emitter voltage of 20V and a continuous collector current of 500mA, with a power dissipation of 300mW at 25°C. The device offers a high DC current gain ranging from 820 to 2700 and a transition frequency of 350MHz. Key electrical characteristics include a typical saturation voltage of 0.18V and a maximum emitter-base breakdown voltage of 12V.
Verify the specific ordering suffix against official documentation to confirm packaging type and binning. Confirm RoHS compliance status as required by project specifications. Check supply status carefully, as this component may be discontinued or restricted for new designs. Ensure the selected variant matches the required hFE classification for the intended circuit application.
Select this component for applications requiring high current gain and low saturation voltage within a 20V limit. Consider the SPT package constraints for through-hole mounting requirements. Evaluate thermal management needs given the 300mW power dissipation rating. Verify that the operating temperature range meets the environmental conditions of the target system.
This part belongs to the 2SD2144S series of medium power transistors manufactured by ROHM Semiconductor. It is designed for general-purpose use in consumer electronics and office automation. The device utilizes an epitaxial planar structure for reliable performance. It is distinct from surface mount variants like the 2SD2114K which uses the SC-59 package.
Consult official manufacturer documentation for verified substitute part numbers. Cross-reference pinouts and electrical parameters before substitution. Ensure any replacement maintains compatibility with the existing PCB layout and thermal design constraints.
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