SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
A3P250-FGG256I is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC FPGA 157 I/O 256FBGA. Review the specifications below when checking this part for your BOM.
The A3P250-FGG256I is a Field Programmable Gate Array from the Microchip ProASIC3 Flash family. It features 250,000 system gates and 3,000 logic elements within a 256-pin Fine-Pitch Ball Grid Array package. The device includes 36 kbit of embedded memory and supports up to 157 user I/Os. Operating voltage ranges from 1.425 V to 1.575 V, with a maximum operating frequency of 350 MHz. It functions across an industrial temperature range of -40°C to +85°C.
Verify the suffix 'I' confirms the industrial temperature grade (-40°C to +85°C). Confirm the package designation FGG256 matches the required 256-pin FBGA footprint. Check datasheet revisions for any pinout updates or electrical parameter changes before finalizing procurement specifications.
Select this component when a non-volatile FPGA solution is required to eliminate external configuration flash devices. Ensure the design utilizes the 1.5 V core voltage constraints. Verify that the 36 kbit SRAM capacity meets the specific data buffering requirements of the application logic.
This part belongs to the ProASIC3 Flash family, which bridges the gap between ASICs and standard SRAM-based FPGAs by offering instant-on functionality. The A3P250 variant provides a mid-range gate count suitable for complex logic applications requiring high reliability and low power consumption in harsh environments.
A3P250-1FGG256I: Same functional logic but potentially different speed grade. A3P250-VQ100I: Pin-compatible alternative using a VQFP package instead of BGA. A3PE250: Enhanced version with additional features; verify pin compatibility and software toolchain support.
Explore related parts through Embedded, Integrated Circuits (ICs), all product categories, ChipApex homepage.