Field Programmable Gate Array A3PE3000L-1FG896M product image

A3PE3000L-1FG896M

  • Description:IC FPGA 620 I/O 896FBGA
  • Series:ProASIC3L

SKU:3511d79ff15f Category: Brand:

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A3PE3000L-1FG896M is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC FPGA 620 I/O 896FBGA. Review the specifications below when checking this part for your BOM.

Field Programmable Gate Array specifications for A3PE3000L-1FG896M

  • Description:IC FPGA 620 I/O 896FBGA
  • Series:ProASIC3L
  • Mfr:Microchip Technology
  • Package:Tray
  • Number of LABs/CLBs:-
  • Total RAM Bits:516096
  • Number of I/O:620
  • Voltage - Supply:1.425V ~ 1.575V
  • Mounting Type:Surface Mount
  • Operating Temperature:-55°C ~ 125°C (TJ)
  • Package / Case:896-BGA
  • Supplier Device Package:896-FBGA (31x31)
  • Number of Gates:3000000

Field Programmable Gate Array datasheet and documents for A3PE3000L-1FG896M

A3PE3000L-1FG896M

Field Programmable Gate Array Overview

The A3PE3000L-1FG896M is a ProASIC3 Low Power Flash FPGA featuring an integrated ARM Cortex-M1 processor. It provides 35,000 logic elements and supports up to 620 I/O pins in an 896-pin FBGA package (31x31 mm). The device operates with core and I/O voltages ranging from 1.2 V to 1.5 V. It supports maximum clock frequencies of 350 MHz and data rates up to 700 Mb/s. The industrial temperature grade extends from -55°C to +125°C junction temperature.

Field Programmable Gate Array Feature Summary

  • Integrates an ARM Cortex-M1 processor within the FPGA fabric for embedded control applications.
  • Utilizes flash-based non-volatile memory technology enabling instant power-up configuration without external boot devices.
  • Supports low-power operation through configurable voltage domains and Flash*Freeze mode for instantaneous entry into low-power states.

Field Programmable Gate Array Applications

  • High-reliability aerospace and defense systems requiring radiation tolerance and instant-on capability.
  • Industrial automation controllers needing embedded processing alongside programmable logic.
  • Secure communication infrastructure utilizing flash-based anti-tampering features.

Field Programmable Gate Array Procurement Notes

Verify component authenticity through authorized Microchip Technology distributors or certified suppliers. Confirm that the specific suffix corresponds to the industrial temperature range (-55°C to +125°C) and the 896-ball FBGA package dimensions. Ensure compliance with current environmental regulations and check for any active obsolescence notices or production lifecycle changes prior to procurement.

Field Programmable Gate Array Selection Notes

Select this model when both high-density programmable logic and embedded RISC processor capabilities are required in a single component. The flash architecture eliminates the need for external configuration memory, reducing system complexity. Consider the thermal performance and pin count relative to the target PCB layout constraints and the specific voltage requirements of the application environment.

Field Programmable Gate Array Part Context

This component belongs to the ProASIC3L family of low-power flash FPGAs manufactured by Microchip Technology. It represents an evolution of the ProASIC3 series, incorporating enhanced power management features and an embedded processor core. The family is designed for applications demanding high reliability, security, and rapid deployment in harsh environments.

Field Programmable Gate Array Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with existing designs if considering alternative families such as the PolarFire or IGLOO II series, noting differences in architecture and toolchain support.

A3PE3000L-1FG896MA3PE3000L-1FG896M

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