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ADT7476ARQZ-REEL7 is listed in the Thermal Management range at ChipApex. The manufacturer field lists Analog Devices Inc.. Its product description is CPU THERMAL AND VOLTAGE MONITOR. Review the specifications below when checking this part for your BOM.
Thermal Management specifications for ADT7476ARQZ-REEL7
- Description：CPU THERMAL AND VOLTAGE MONITOR
- Series：dBCool®
- Mfr：Analog Devices Inc.
- Package：Bulk
- Function：Fan Control, Temp Monitor
- Sensor Type：Internal and External
- Sensing Temperature：-40°C ~ 125°C
- Accuracy：±2.5%
- Topology：ADC, Comparator, Fan Speed Counter, Multiplexer, Register Bank
- Output Type：SMBus
- Output Alarm：No
- Output Fan：Yes
- Voltage - Supply：3V ~ 3.6V
- Operating Temperature：-40°C ~ 125°C
- Grade：-
- Qualification：-
- Mounting Type：Surface Mount
- Package / Case：24-SSOP (0.154", 3.90mm Width)
- Supplier Device Package：24-QSOP
Thermal Management datasheet and documents for ADT7476ARQZ-REEL7
Thermal Management Overview
The ADT7476ARQZ-REEL7 is a board-mount temperature sensor IC manufactured by Analog Devices Inc. It features a QSOP-24 surface mount package and operates within a supply voltage range of 2.35 V to 5.25 V for both analog and digital domains. The device supports I2C, SMBus, and 2-Wire serial interfaces for data communication. It provides remote temperature monitoring capabilities with an accuracy of +/- 0.5°C and functions across a wide operating temperature range from -40°C to +125°C.
Thermal Management Feature Summary
- Integrated remote thermal monitoring with high precision
- Supports multiple standard serial communication protocols
- Designed for active system cooling applications
Thermal Management Applications
- Blade server fan monitoring
- Fan controller systems
- Motor and motion control thermal management
Thermal Management Procurement Notes
Verify the manufacturer designation carefully, as this specific part number prefix has been associated with onsemi in certain distributor databases. Confirm the exact datasheet revision and pinout compatibility before integration. Ensure the ordering suffix matches the required reel packaging specifications for your assembly line.
Thermal Management Selection Notes
Select this component when a compact solution for multi-channel thermal monitoring is required alongside fan speed control. The dual power supply design allows flexibility in interfacing with different logic levels. Consider the QSOP-24 footprint constraints during PCB layout planning to ensure adequate thermal dissipation and signal integrity.
Thermal Management Part Context
This device belongs to the ADT7476 family of hardware monitors designed for complex thermal environments. It integrates temperature sensing with fan control logic, distinguishing it from standalone sensors. The series is commonly utilized in industrial and computing infrastructure where precise thermal regulation is critical for system stability.
Thermal Management Replacement Considerations
Public confirmed substitute part numbers are not available in the provided documentation.
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