AGFA008R16A2I1VB

Soc System On Chip Overview

The AGFA008R16A2I1VB is an FPGA from the Agilex 7 F series, manufactured by Altera. It features a logic element count of 764,000 LE and includes 0 bit of embedded memory. The device is housed in a Tray package and exhibits moisture sensitivity. This component belongs to the Agilex trademark family and falls under programmable logic ICs.

Soc System On Chip Feature Summary

• Agilex 7 F series architecture
• High-density logic capacity
• Moisture sensitive packaging

Soc System On Chip Applications

• Signal integrity analysis using IBIS models
• Electromagnetic compatibility (EMC) simulation
• Programmable logic integrated circuit design

Soc System On Chip Procurement Notes

Verify official datasheets for complete electrical specifications and thermal resistance data. Confirm package mechanical drawings and ball coordinate lists are available for your specific design requirements. Check for restricted access documents regarding compact thermal models and manufacturing advantage services if needed for advanced integration.

Soc System On Chip Selection Notes

Select this part for applications requiring high logic density within the Agilex 7 ecosystem. Ensure design tools support the F series I series model updates. Verify that the system environment accommodates the specified moisture sensitivity level and tray packaging constraints during assembly.

Soc System On Chip Part Context

This component is part of the broader Agilex 7 family, which includes M, F, and other series variants. It shares modeling standards with other current FPGAs, such as those supported by IBIS models for signal integrity analysis. The family emphasizes advanced processing capabilities and configurable logic resources.

Soc System On Chip FAQ

What modeling standard supports signal integrity analysis for this device?

IBIS models are provided for Altera devices, covering minimum, typical, and maximum process, voltage, and temperature conditions to support signal integrity and EMC analysis.

Where can package mechanical drawings be found?

Package mechanical drawings and ball coordinate lists for the Agilex 7 family are accessible through official FPGA package and thermal information links.