AGFB006R24C2I3V

Overview

The AGFB006R24C2I3V is an Agilex 7 F-Series FPGA featuring 573,000 logic elements. It operates within a temperature range of -40°C to 100°C (TJ) and utilizes a 2340-ball FBGA package. The device supports SMD/SMT mounting and carries MSL 3 moisture sensitivity rating.

Feature Summary

• Agilex 7 F-Series architecture with 573K logic elements
• Industrial operating temperature range up to 100°C TJ
• High-density 2340-ball FBGA packaging for system integration

Applications

• System integration requiring high-density programmable logic
• Industrial applications necessitating extended temperature stability
• Embedded systems utilizing Agilex FPGA capabilities

Procurement Notes

Verify availability through official Altera channels or authorized distributors, as stock status varies by region. Confirm the specific suffix I3V corresponds to the required industrial temperature grade and package variant. Ensure compliance with RoHS directives and MSL handling procedures during assembly.

Selection Notes

Select this component when 573K LE capacity and industrial thermal performance are required. Compare against other Agilex 7 variants based on I/O count and package size. Validate that the 2340-ball FBGA footprint matches the target PCB design constraints.

Part Context

This part belongs to the Agilex 7 family, specifically the F-Series designed for high-performance logic applications. It represents a mid-range density option within the 006 series, balancing resource utilization with physical package constraints for complex digital designs.