AGFB022R25A2I3E

Overview

The AGFB022R25A2I3E is a System on Chip FPGA belonging to the Intel Agilex 7 F-Series. It utilizes a 2581-pin FineLine Ball-Grid Array (FBGA) package designed for surface-mount installation. The device integrates programmable logic with embedded processing capabilities, supporting complex system architectures within a single component. Official documentation identifies this specific part number as an SoC FPGA variant within the Agilex 7 family, distinct from pure logic FPGA models.

Feature Summary

• Integrates programmable logic fabric with embedded processor subsystems for unified system design
• Utilizes high-density interconnect architecture optimized for advanced packaging requirements
• Supports integration of hard IP blocks and external memory interfaces within the silicon die

Applications

• High-performance computing infrastructure requiring integrated processing and acceleration
• Telecommunications baseband processing systems demanding low latency and high throughput
• Industrial automation controllers utilizing combined logic and control processing

Procurement Notes

Verify the exact suffix configuration against official Intel datasheets before procurement, as minor alphanumeric changes in the ordering code can indicate differences in temperature grades, package variants, or delivery forms. Confirm availability status directly with authorized distributors, as supply chain constraints may affect immediate shipment readiness for specific Agilex 7 configurations.

Selection Notes

Select this model when a unified solution combining ARM Cortex-A cores with configurable logic fabric is required. Ensure the 2581-pin FBGA footprint aligns with the target PCB layout constraints. Validate that the specific R25A package option meets the thermal and mechanical requirements of the final enclosure design compared to alternative package sizes in the same family.

Part Context

This component belongs to the Intel Agilex 7 F-Series, representing a generation of FPGAs built on advanced process nodes. The Agilex 7 family introduces new architectural features compared to previous Stratix and Arria generations, focusing on improved performance-per-watt and enhanced security features for enterprise and data center applications.

Replacement Considerations

Direct pin-to-pin replacements are not publicly documented for this specific SoC variant. Consider evaluating other Agilex 7 F-Series SoC models with compatible pin counts or migrating to Agilex 9 series devices if higher performance is needed, subject to full schematic and firmware redesign.