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Product Detailed Parameters
- Description:DIODE SIC 650V 16A PGTO247341
- Series:CoolSiC™
- Mfr:Infineon Technologies
- Package:Tube
- Technology:SiC (Silicon Carbide) Schottky
- Voltage - DC Reverse (Vr) (Max):650 V
- Current - Average Rectified (Io):16A
- Voltage - Forward (Vf) (Max) @ If:1.7 V @ 16 A
- Speed:No Recovery Time > 500mA (Io)
- Reverse Recovery Time (trr):0 ns
- Current - Reverse Leakage @ Vr:90 µA @ 650 V
- Capacitance @ Vr, F:471pF @ 1V, 1MHz
- Mounting Type:Through Hole
- Package / Case:TO-247-3
- Supplier Device Package:PG-TO247-3-41
- Operating Temperature - Junction:-40°C ~ 175°C
- Grade:Automotive
- Qualification:AEC-Q100/101
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Overview
The AIDW16S65C5 is a 650V/16A Silicon Carbide Schottky Diode in the PG-TO247-3 package. It features a maximum repetitive reverse voltage of 650 V and a continuous forward current of 16 A at TC = 129 °C. The junction temperature range spans from -40°C to 175°C, with a power dissipation of 94 W at TC = 25°C. Non-repetitive peak forward current reaches 637 A (10µs) and surge current is 95 A (10ms). Forward voltage is typically 1.5 V at 16 A and 25°C.
Feature Summary
- Automotive qualified product validated according to AEC-Q100/101 standards
- Temperature independent switching behavior with no reverse or forward recovery
- High dv/dt ruggedness rated at 100 V/ns under specified conditions
- Low figure of merit (Qc x Vf) enabling improved system efficiency
Applications
- Traction inverter systems
- Booster and DCDC converters
- On-board chargers and PFC circuits
Procurement Notes
Verify component authenticity through authorized Infineon distributors. Confirm that the ordering code matches the specific automotive grade designation. Ensure compliance with RoHS requirements and Pb-free lead plating specifications during procurement. Validate storage temperature limits between -55°C and 150°C to maintain device integrity prior to assembly.
Selection Notes
Select this component for high-frequency applications requiring reduced cooling due to lower operating temperatures. Consider its compatibility with Infineon IGBT and CoolMOS portfolios for optimized system design. Evaluate thermal resistance parameters against heat sink capabilities to ensure junction temperature remains within the 175°C maximum limit during operation.
Part Context
This device belongs to the 5th Generation CoolSiC Automotive Schottky Diode family. It utilizes thin wafer technology to achieve benchmark switching behavior. The product is designed to complement existing silicon-based solutions while offering higher reliability and reduced electromagnetic interference in demanding power electronics environments.
Replacement Considerations
No public confirmed substitute part numbers are documented.
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