AM2329P

AM2329P

$0.15
  • Description:MOSFET P-CH -30V 2.8A SOT-23
  • Series:-
  • Mfr:Analog Power Inc.
  • Package:Bulk

SKU:a1134320e4a5 Category: Brand:

  
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Product Detailed Parameters

  • Description:MOSFET P-CH -30V 2.8A SOT-23
  • Series:-
  • Mfr:Analog Power Inc.
  • Package:Bulk
  • FET Type:P-Channel
  • Technology:MOSFET (Metal Oxide)
  • Drain to Source Voltage (Vdss):30 V
  • Current - Continuous Drain (Id) @ 25°C:2.5A (Ta)
  • Drive Voltage (Max Rds On, Min Rds On):4.5V, 10V
  • Rds On (Max) @ Id, Vgs:112mOhm @ 2.5A, 10V
  • Vgs(th) (Max) @ Id:1V @ 250µA
  • Gate Charge (Qg) (Max) @ Vgs:4.5 nC @ 5 V
  • Vgs (Max):±20V
  • Input Capacitance (Ciss) (Max) @ Vds:-
  • FET Feature:-
  • Power Dissipation (Max):1.3W (Ta)
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Grade:-
  • Qualification:-
  • Mounting Type:Surface Mount
  • Supplier Device Package:SOT-23
  • Package / Case:TO-236-3, SC-59, SOT-23-3

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AM2329P

Overview

The AM2329P is a P-Channel MOSFET manufactured by Analog Power Inc. It utilizes high cell density trench technology to achieve low on-resistance and minimal power loss. The device features a SOT-23 package with a copper leadframe for low thermal impedance. Key electrical characteristics include a drain-source voltage of -20V, a gate-source voltage of ±8V, and a continuous drain current of -1.7A at VGS = -1.8V. The on-resistance is specified as 0.290 Ohms under the same conditions.

Feature Summary

  • High cell density trench process for low DS(on)
  • Low thermal impedance copper leadframe
  • Fast switching speed capability

Applications

  • DC-DC converters
  • Power management in portable products
  • Battery-powered devices such as cellular telephones

Procurement Notes

Verify the manufacturer designation as Analog Power Inc. when sourcing this component. Confirm the specific datasheet version matches the required electrical parameters, particularly the on-resistance values at different gate-source voltages. Ensure the physical package corresponds to the standard SOT-23 footprint to maintain compatibility with existing board layouts.

Selection Notes

Select this part for applications requiring efficient power management in compact designs. The low on-resistance supports higher efficiency and extended battery life in portable electronics. Consider the thermal performance provided by the copper leadframe for heat dissipation requirements within the small form factor constraints of the SOT-23 package.

Part Context

This component belongs to the Analog Power Inc. lineup of miniature surface mount MOSFETs. These devices are engineered to provide low power loss and effective heat dissipation. The product line targets power management solutions for portable and battery-operated consumer electronics where space and efficiency are critical design factors.

Replacement Considerations

Public confirmed substitute part numbers are not available in the verified documentation.

AM2329PAM2329P
$0.15
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