AOB66515L

$2.91

Description：LINEAR IC
Series：AlphaSGT™
Mfr：Alpha & Omega Semiconductor Inc.
Package：Tape & Reel (TR)

SKU:920f9e71ce50 Category: Single FETs, MOSFETs Brand: Alpha & Omega Semiconductor Inc.

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Product introduction

Product Detailed Parameters

Description：LINEAR IC
Series：AlphaSGT™
Mfr：Alpha & Omega Semiconductor Inc.
Package：Tape & Reel (TR)
FET Type：N-Channel
Technology：MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss)：150 V
Current - Continuous Drain (Id) @ 25°C：27A (Ta), 120A (Tc)
Drive Voltage (Max Rds On, Min Rds On)：6V, 10V
Rds On (Max) @ Id, Vgs：4.8mOhm @ 20A, 10V
Vgs(th) (Max) @ Id：3V @ 250µA
Gate Charge (Qg) (Max) @ Vgs：270 nC @ 10 V
Vgs (Max)：±20V
Input Capacitance (Ciss) (Max) @ Vds：16700 pF @ 75 V
FET Feature：-
Power Dissipation (Max)：10W (Ta), 375W (Tc)
Operating Temperature：-55°C ~ 175°C (TJ)
Grade：-
Qualification：-
Mounting Type：Surface Mount
Supplier Device Package：TO-263 (D2PAK)
Package / Case：TO-263-3, D2PAK (2 Leads + Tab), TO-263AB

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AOB66515L

Overview

The AOB66515L is an N-channel power MOSFET manufactured by Alpha & Omega Semiconductor Inc. It features a drain-source voltage rating of 150 V and a continuous drain current capacity of 27 A at ambient temperature, extending to 120 A at case temperature. The device dissipates 10 W at ambient and 375 W at case conditions. It utilizes a surface-mount TO-263 (D2PAK) package for thermal management.

Feature Summary

N-channel enhancement mode construction
High current handling capability with dual thermal ratings
Surface-mount D2PAK packaging for efficient heat dissipation

Applications

DC-DC converter circuits
Motor control systems
Power supply units

Procurement Notes

Verify the specific suffix and revision level against the manufacturer's latest datasheet to ensure compatibility with design requirements. Confirm RoHS compliance status and check for any product change notices or obsolescence alerts prior to finalizing procurement plans.

Selection Notes

Select this component when a 150 V rating and high surge current capability are required in a D2PAK form factor. Evaluate thermal resistance parameters relative to the PCB copper area and heatsinking strategy to ensure the junction temperature remains within safe operating limits under maximum load conditions.

Part Context

This part belongs to Alpha & Omega Semiconductor’s portfolio of discrete power devices designed for high-volume applications. The company integrates process technology and advanced packaging to address complex power requirements in consumer electronics, industrial controls, and automotive sectors.