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AOTF2618L is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Alpha & Omega Semiconductor Inc.. Its product description is MOSFET N-CH 60V 7A/22A TO220-3F. Review the specifications below when checking this part for your BOM.
The AOTF2618L is a 60V N-Channel MOSFET utilizing trench technology optimized for high-frequency switching. It features a maximum drain-source voltage of 60V and a continuous drain current of 23A at TC=25°C. The device exhibits an on-resistance of less than 19mΩ at VGS=10V and less than 25mΩ at VGS=4.5V. It includes 100% UIS and Rg testing, with a junction temperature range of -55°C to 175°C.
Verify the specific package variant required, as the datasheet covers TO-220, TO-220F, and TO-263 (D2PAK) packages under the same part number family. Confirm thermal management requirements against the provided junction-to-case and junction-to-ambient resistance values. Ensure design compliance with the absolute maximum ratings, particularly regarding the 175°C maximum junction temperature limit during operation.
Select this component for applications requiring robust high-frequency switching capabilities within a 60V system. The low gate charge and fast switching times make it suitable for space-constrained designs where efficiency is critical. Consider the thermal characteristics carefully; use the junction-to-case resistance for heatsink calculations or junction-to-ambient for board-level thermal analysis without additional cooling.
This device belongs to Alpha & Omega Semiconductor's 60V N-Channel MOSFET lineup. It shares core electrical specifications with the AOT2618L (TO-220) and AOB2618L (TO-263/D2PAK) variants. The primary distinction lies in the physical package form factor, which dictates mounting method and thermal dissipation characteristics relative to the PCB layout.
Direct functional equivalents include the AOT2618L and AOB2618L from the same manufacturer series. When substituting, verify that the replacement package matches the mechanical footprint and thermal interface requirements of the original design.
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