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Product Detailed Parameters
- Description:DIODE ARRAY GP 600V 20A TO247
- Series:-
- Mfr:Microchip Technology
- Package:Tube
- Diode Configuration:1 Pair Series Connection
- Technology:Standard
- Voltage - DC Reverse (Vr) (Max):600 V
- Current - Average Rectified (Io) (per Diode):20A
- Voltage - Forward (Vf) (Max) @ If:4 V @ 30 A
- Speed:Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):24 ns
- Current - Reverse Leakage @ Vr:250 µA @ 600 V
- Operating Temperature - Junction:-55°C ~ 150°C
- Mounting Type:Through Hole
- Package / Case:TO-247-2
- Supplier Device Package:TO-247 [B]
- Grade:-
- Qualification:-
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Overview
The APT30DS60BG is a dual series-connected fast recovery epitaxial diode (FRED) manufactured by Microchip Technology. It features a maximum repetitive peak reverse voltage of 600 V and an average forward rectified current of 30 A. The device exhibits a typical forward voltage of 2.4 V at 30 A and a maximum reverse leakage current of 25 µA at 600 V. Designed for through-hole mounting in TO-247 packages, it supports junction temperatures from -55°C to 175°C with a soft recovery characteristic.
Feature Summary
- Dual series configuration within a single package
- Soft recovery characteristics for reduced switching noise
- High thermal stability up to 175°C junction temperature
Applications
- High-frequency DC-DC converters
- Uninterruptible power supply (UPS) systems
- Induction heating circuits
Procurement Notes
Verify the specific suffix against official Microchip documentation to confirm pinout and electrical tolerances. Ensure the procurement channel provides valid traceability records. Confirm that the TO-247 package variant matches the design requirements for thermal management and mechanical clearance in the target assembly.
Selection Notes
Select this component for applications requiring high-speed switching with minimal reverse recovery charge. The dual series structure simplifies circuit layout compared to discrete parallel or series arrangements. Evaluate thermal resistance requirements to ensure the heat sink design accommodates the power dissipation limits defined in the datasheet.
Part Context
This part belongs to Microchip's FRED diode portfolio, designed for efficient power conversion. It complements other high-voltage rectifiers in the series, offering a balance between speed and robustness. The TO-247 form factor allows for direct board mounting or heatsink attachment, supporting industrial-grade reliability standards.
Replacement Considerations
Consult official substitution lists for equivalent dual-series FRED diodes. Verify that any alternative maintains the 600 V rating and 30 A current capacity. Ensure the replacement package matches the TO-247 footprint to avoid mechanical redesign.
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