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The APT40GP90J is a single IGBT module from Microchip Technology's POWER MOS 7 series, utilizing PT technology. It features a 900 V collector-emitter breakdown voltage and a maximum continuous collector current of 68 A at 25°C. The device has a maximum power dissipation of 284 W and operates within a junction temperature range of -55°C to 150°C. Key electrical parameters include a saturated collector-emitter voltage of 3.2 V (max) and an input capacitance of 3.3 nF at 25 V. It is housed in an ISOTOP-4 package (SOT-227-4 miniBLOC) with base mounting.
Verify the specific ordering suffix against the manufacturer's latest datasheet to confirm pinout compatibility and thermal interface specifications. Ensure that the procurement documentation explicitly references the ISOTOP-4 package variant to avoid confusion with other SOT-227 configurations. Cross-reference the RoHS compliance status with current regulatory requirements for the target market.
Select this component when a single-switch configuration with 900 V blocking capability is required. The 68 A current rating suits applications demanding moderate power handling in compact footprints. Consider the 3.2 V saturation voltage for efficiency calculations in low-voltage drop scenarios. Verify that the thermal management solution can handle the 284 W dissipation limit under worst-case operating conditions.
This part belongs to the APT40GP90 family, which includes variants like APT40GP90B2DQ2G. These devices are designed for hard-switching applications requiring fast recovery and low conduction losses. The ISOTOP package distinguishes it from through-hole TO-247 counterparts by offering superior heat transfer to a printed circuit board or heatsink via the base terminal.
Direct substitutes may include other 900 V single IGBT modules in ISOTOP-4 packages from Microchip or compatible manufacturers. Verify that replacement parts match the 68 A current rating and 284 W power dissipation limits. Check for identical pin assignments and thermal resistance values to ensure mechanical and electrical interchangeability without redesigning the PCB layout.