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Product Detailed Parameters
- Description：IGBT MOD 600V 100A 329W ISOTOP
- Series：POWER MOS 7®
- Mfr：Microchip Technology
- Package：Tube
- IGBT Type：PT
- Configuration：Single
- Vce(on) (Max) @ Vge, Ic：2.7V @ 15V, 50A
- Input：Standard
- NTC Thermistor：No
- Operating Temperature：-55°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：SOT-227-4, miniBLOC
- Supplier Device Package：ISOTOP®
- Voltage - Collector Emitter Breakdown (Max)：600 V
- Current - Collector (Ic) (Max)：100 A
- Power - Max：329 W
- Current - Collector Cutoff (Max)：525 µA
- Input Capacitance (Cies) @ Vce：5.7 nF @ 25 V
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Overview
The APT50GP60JDQ2 is a single IGBT module manufactured by Microchip Technology, utilizing Silicon technology and Power MOS 7 planar trench field-stop architecture. It features an ISOTOP-4 surface-mount package designed for high thermal efficiency. The device supports a maximum collector-emitter voltage of 600 V and delivers a continuous collector current of 100 A at 25°C. Key electrical parameters include a collector-emitter saturation voltage of 2.2 V, a gate-emitter leakage current of 100 nA, and a power dissipation rating of 329 W. The component operates within a junction temperature range of -55°C to +150°C and accepts a maximum gate-emitter voltage of 30 V.
Feature Summary
- Integrates Power MOS 7 planar trench field-stop technology for optimized switching performance and low conduction loss.
- Utilizes ISOTOP-4 surface-mount packaging to provide direct thermal coupling between the collector pad and the heatsink.
- Features a single configuration suitable for compact circuit board layouts requiring screw or SMD mounting options.
Applications
- High-frequency motor drive inverters
- Switched-mode power supplies (SMPS)
- Induction heating systems
Procurement Notes
Verify the specific suffix JDQ2 against official Microchip documentation to confirm lead finish and tape-and-reel specifications. Ensure the ordering quantity aligns with manufacturer minimums. Confirm RoHS compliance status through the latest datasheet revision before finalizing procurement orders.
Selection Notes
Select this component when a surface-mount solution is required for 600 V applications. The ISOTOP-4 package offers superior thermal conductivity compared to standard TO-247 variants. Verify that the PCB layout supports the specific pinout and thermal pad requirements of the SMD configuration.
Part Context
This part belongs to the APT series of insulated gate bipolar transistors from Microchip Technology. It represents a transition toward surface-mount technologies within the traditionally through-hole focused IGBT portfolio. The device shares architectural similarities with other APT50GP60 variants but differs in package type and mounting style.
Replacement Considerations
Direct replacements include APT50GP60BG and APT50GP60B2DQ2G. Note that these alternatives utilize different packages such as TO-247AD, requiring significant PCB redesign and mechanical adaptation rather than simple pin-to-pin substitution.
