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Product Detailed Parameters
- Description：MOSFET 2N-CH 600V 95A SP1
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- Technology：MOSFET (Metal Oxide)
- Configuration：2 N-Channel (Half Bridge)
- FET Feature：-
- Drain to Source Voltage (Vdss)：600V
- Current - Continuous Drain (Id) @ 25°C：95A
- Rds On (Max) @ Id, Vgs：24mOhm @ 47.5A, 10V
- Vgs(th) (Max) @ Id：3.9V @ 5mA
- Gate Charge (Qg) (Max) @ Vgs：300nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds：14400pF @ 25V
- Power - Max：462W
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：SP1
- Supplier Device Package：SP1
- Grade：-
- Qualification：-
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Overview
The APTC60AM24T1G is a silicon-based PM-MOSFET CoolMOS SP1 module manufactured by Microchip Technology. It utilizes the SP1 package configuration and is supplied in tube packaging. The component belongs to the discrete and power modules sub-category, specifically designed for high-power switching applications requiring robust MOSFET integration within a single module form factor.
Feature Summary
- Integrates Power MOSFET technology within a dedicated module housing for enhanced thermal management
- Utilizes Silicon (Si) semiconductor material for reliable high-voltage switching performance
- Designed with the SP1 module package architecture to facilitate surface or screw mounting
Applications
- Industrial motor drives
- Uninterruptible power supplies (UPS)
- High-frequency power conversion systems
Procurement Notes
Verify the specific datasheet revision and errata documents, particularly regarding the SP1 to SP1F module package clarification, before finalizing design integration. Confirm RoHS compliance status and ensure the ordering suffix matches the required package variant. Cross-reference the manufacturer part number with official Microchip documentation to avoid substitution errors.
Selection Notes
Select this component when a pre-configured MOSFET module is preferred over discrete components for improved reliability and reduced board space. Consider the SP1 package constraints and thermal requirements. Ensure the application voltage and current ratings align with the CoolMOS SP1 series specifications provided in the official technical data sheet.
Part Context
This part is part of Microchip's CoolMOS SP1 family of power modules. It represents a consolidation of MOSFET switches into a single unit, differing from standard discrete transistors. The product line focuses on providing integrated solutions for power electronics, distinguishing itself through specific module packaging and optimized internal interconnects for high-performance applications.
Replacement Considerations
Consult the official Microchip compatibility matrix for direct replacements. Verify pinout and electrical characteristics against similar SP1 series modules. Do not assume interchangeability with non-SP1 packages without rigorous validation.
