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Product Detailed Parameters
- Description：MOSFET 2N-CH 600V 95A SP3
- Series：CoolMOS™
- Mfr：Microchip Technology
- Package：Tray
- Technology：MOSFET (Metal Oxide)
- Configuration：2 N-Channel (Dual) Asymmetrical
- FET Feature：-
- Drain to Source Voltage (Vdss)：600V
- Current - Continuous Drain (Id) @ 25°C：95A
- Rds On (Max) @ Id, Vgs：24mOhm @ 47.5A, 10V
- Vgs(th) (Max) @ Id：3.9V @ 5mA
- Gate Charge (Qg) (Max) @ Vgs：300nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds：14400pF @ 25V
- Power - Max：462W
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：SP3
- Supplier Device Package：SP3
- Grade：-
- Qualification：-
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Overview
The APTC60DHM24T3G is a dual N-channel MOSFET module from Microchip Technology, utilizing CoolMOS SP3F technology. It features a 600V drain-source breakdown voltage and supports a continuous drain current of 95A. The device has a maximum on-resistance of 24mΩ at 25°C. It operates within a temperature range of -40°C to +150°C and offers a power dissipation rating of 462W. The package type is SP3, designed for chassis mounting.
Feature Summary
- Kelvin source connection facilitates easy gate drive with reduced stray inductance.
- Internal thermistor provides accurate temperature monitoring capabilities.
- Rated avalanche energy capability enhances robustness in switching applications.
Applications
- Industrial motor drives
- Uninterruptible power supplies (UPS)
- High-frequency DC-DC converters
Procurement Notes
Verify the specific suffix T3G indicates RoHS compliance and tube packaging configuration. Confirm the SP3 package dimensions match your thermal management design. Ensure the Kelvin source pin is correctly connected to minimize switching noise. Cross-reference the datasheet revision date to confirm parameter stability before finalizing procurement.
Selection Notes
Select this component when high efficiency and ruggedness are required in medium-power switching circuits. The dual configuration allows for half-bridge topologies without external balancing. Consider the 24mΩ on-resistance for conduction loss calculations. Evaluate the thermal resistance characteristics against your heatsink capacity for optimal performance under continuous load conditions.
Part Context
This part belongs to the APTC series of discrete semiconductor modules. It represents an evolution in CoolMOS technology, offering improved switching characteristics compared to earlier generations. The SP3 package is standard for industrial power modules requiring screw or chassis mounting. It complements other single-channel variants in the same voltage class.
Replacement Considerations
Direct substitutes include the APTC60HM24T3G for single-channel applications and the APTC60HM35T3G for higher resistance options. Verify pin compatibility and thermal interface requirements when swapping between these variants. Ensure the replacement part maintains the same SP3 package footprint for mechanical integration.
