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Product Detailed Parameters
- Description：MOSFET 2N-CH 800V 28A SP3
- Series：-
- Mfr：Microsemi Corporation
- Package：Bulk
- Technology：MOSFET (Metal Oxide)
- Configuration：2 N-Channel (Dual)
- FET Feature：-
- Drain to Source Voltage (Vdss)：800V
- Current - Continuous Drain (Id) @ 25°C：28A
- Rds On (Max) @ Id, Vgs：150mOhm @ 14A, 10V
- Vgs(th) (Max) @ Id：3.9V @ 2mA
- Gate Charge (Qg) (Max) @ Vgs：180nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds：4507pF @ 25V
- Power - Max：277W
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：SP3
- Supplier Device Package：SP3
- Grade：-
- Qualification：-
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Overview
The APTC80DSK15T3G is a dual buck chopper Super Junction MOSFET power module manufactured by Microsemi Corporation. It features an SP3 package designed for baseplate mounting. The device integrates two N-channel MOSFETs rated for 800V drain-source voltage and 28A continuous drain current at case temperature. Key electrical characteristics include a maximum gate charge of 300 nC at 10 V, a maximum input capacitance of 7736 pF at 25 V, and a maximum on-resistance of 672 mΩ at 14 A and 10 V. The module supports a junction temperature range from -40°C to 150°C and operates with a maximum gate-source voltage of ±30 V.
Feature Summary
- Integrates two N-channel Super Junction MOSFETs in a single dual buck chopper configuration
- Engineered for high-voltage applications with 800V blocking capability
- Utilizes SP3 baseplate-mounted packaging for efficient thermal management
Applications
- Dual buck chopper converter circuits
- High-power DC-DC conversion systems
- Industrial motor drive inverters
Procurement Notes
Verify the specific suffix T3G against the manufacturer's latest datasheet to confirm pinout compatibility and thermal interface specifications. Confirm that the SP3 package dimensions match the intended heatsink design. Check for any recent obsolescence notices or lifecycle status updates from Microsemi prior to finalizing procurement plans.
Selection Notes
Select this component when a compact dual-switch solution is required for high-voltage buck topologies. The Super Junction technology offers improved switching performance compared to standard planar devices. Ensure the application can accommodate the 28A current rating and that the SP3 mechanical footprint fits within the system constraints.
Part Context
This module belongs to Microsemi's family of high-voltage power discrete and module products. It is part of the APTC series, which focuses on dual configurations for bridge and chopper applications. The product line targets industrial and automotive sectors requiring robust power semiconductor solutions with integrated thermal capabilities.
Replacement Considerations
Public confirmed substitute part numbers are not available in the provided documentation. Users should consult Microsemi directly for cross-reference recommendations or equivalent modules with compatible voltage and current ratings.
