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The APTCV60HM45BT3G is a press-fit IGBT module from Microchip Technology, housed in the SP-3F package. It features a 600V voltage rating and a continuous collector current of 38A. The device supports a maximum repetitive peak current of 130A and dissipates up to 250W of power. Designed for high-efficiency applications, it utilizes IGBT3 technology to achieve low voltage drop and reduced tail current characteristics.
Verify the specific suffix 'T3G' against official Microchip documentation to confirm RoHS compliance status and lead time requirements. Ensure the procurement channel sources directly from authorized distributors to guarantee authenticity. Confirm that the SP-3F package dimensions match the target PCB footprint before finalizing orders.
Select this component when a 600V rating and 38A continuous current are required within a compact SP-3F form factor. The press-fit interface eliminates soldering thermal stress, making it suitable for applications requiring robust mechanical stability. Evaluate thermal management needs based on the 250W dissipation limit and ensure adequate heatsinking for the intended operating environment.
This module belongs to Microchip's PM-IGBT-TFS-SP3F product family, which focuses on high-speed IGBT4 and IGBT3 technologies. These modules are engineered for 1200V and 600V systems, offering low switch losses and low forward voltage drops. The SP-3F package provides a standardized solution for power electronics designers seeking reliable, press-fit mounted components.
No public confirmed substitute part numbers are available in the provided data. Cross-referencing requires matching the 600V/38A specifications, SP-3F package type, and press-fit mounting style with other manufacturers' offerings.