APTCV60HM45BT3G

APTCV60HM45BT3G

$76.90
  • Description:IGBT MODULE 600V 50A 250W SP3
  • Series:-

SKU:0a8d0ae92901 Category: Brand:

  
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Product Detailed Parameters

  • Description:IGBT MODULE 600V 50A 250W SP3
  • Series:-
  • Mfr:Microchip Technology
  • Package:Bulk
  • IGBT Type:Trench Field Stop
  • Configuration:Boost Chopper, Full Bridge
  • Vce(on) (Max) @ Vge, Ic:1.9V @ 15V, 50A
  • Input:Standard
  • NTC Thermistor:Yes
  • Operating Temperature:-40°C ~ 150°C (TJ)
  • Mounting Type:Chassis Mount
  • Package / Case:SP3
  • Supplier Device Package:SP3
  • Voltage - Collector Emitter Breakdown (Max):600 V
  • Current - Collector (Ic) (Max):50 A
  • Power - Max:250 W
  • Current - Collector Cutoff (Max):250 µA
  • Input Capacitance (Cies) @ Vce:3.15 nF @ 25 V

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APTCV60HM45BT3G

Overview

The APTCV60HM45BT3G is a press-fit IGBT module from Microchip Technology, housed in the SP-3F package. It features a 600V voltage rating and a continuous collector current of 38A. The device supports a maximum repetitive peak current of 130A and dissipates up to 250W of power. Designed for high-efficiency applications, it utilizes IGBT3 technology to achieve low voltage drop and reduced tail current characteristics.

Feature Summary

  • Press-in PCB mounting configuration for secure mechanical connection
  • IGBT3 technology implementation for optimized switching performance
  • Low voltage drop design to minimize conduction losses
  • Reduced tail current characteristics for efficient operation

Applications

  • Industrial motor drives
  • Uninterruptible power supplies (UPS)
  • High-frequency inverters

Procurement Notes

Verify the specific suffix 'T3G' against official Microchip documentation to confirm RoHS compliance status and lead time requirements. Ensure the procurement channel sources directly from authorized distributors to guarantee authenticity. Confirm that the SP-3F package dimensions match the target PCB footprint before finalizing orders.

Selection Notes

Select this component when a 600V rating and 38A continuous current are required within a compact SP-3F form factor. The press-fit interface eliminates soldering thermal stress, making it suitable for applications requiring robust mechanical stability. Evaluate thermal management needs based on the 250W dissipation limit and ensure adequate heatsinking for the intended operating environment.

Part Context

This module belongs to Microchip's PM-IGBT-TFS-SP3F product family, which focuses on high-speed IGBT4 and IGBT3 technologies. These modules are engineered for 1200V and 600V systems, offering low switch losses and low forward voltage drops. The SP-3F package provides a standardized solution for power electronics designers seeking reliable, press-fit mounted components.

Replacement Considerations

No public confirmed substitute part numbers are available in the provided data. Cross-referencing requires matching the 600V/38A specifications, SP-3F package type, and press-fit mounting style with other manufacturers' offerings.

APTCV60HM45BT3GAPTCV60HM45BT3G
$76.90
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