APTCV60HM45RT3G

APTCV60HM45RT3G

$65.79
  • Description:IGBT MODULE 600V 50A 250W SP3
  • Series:-

SKU:bfc1b9a7f665 Category: Brand:

  
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Product Detailed Parameters

  • Description:IGBT MODULE 600V 50A 250W SP3
  • Series:-
  • Mfr:Microchip Technology
  • Package:Bulk
  • IGBT Type:Trench Field Stop
  • Configuration:Full Bridge Inverter
  • Vce(on) (Max) @ Vge, Ic:1.9V @ 15V, 50A
  • Input:Single Phase Bridge Rectifier
  • NTC Thermistor:Yes
  • Operating Temperature:-40°C ~ 175°C (TJ)
  • Mounting Type:Chassis Mount
  • Package / Case:SP3
  • Supplier Device Package:SP3
  • Voltage - Collector Emitter Breakdown (Max):600 V
  • Current - Collector (Ic) (Max):50 A
  • Power - Max:250 W
  • Current - Collector Cutoff (Max):250 µA
  • Input Capacitance (Cies) @ Vce:3.15 nF @ 25 V

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APTCV60HM45RT3G

Overview

The APTCV60HM45RT3G is a MOSFET module from Microchip Technology utilizing CoolMOS SP3F technology. It features a 600V collector-emitter voltage and a continuous collector current of 50A at 25°C, with a maximum pulsed drain current of 130A. The device operates within a junction temperature range of -40°C to 150°C and employs an SP3F press-in PCB package for direct mounting.

Feature Summary

  • Integrates CoolMOS SP3F field-stop trench technology for optimized switching performance
  • Features a press-in PCB mechanical mounting configuration for secure installation
  • Designed for high-power applications requiring robust thermal management

Applications

  • Switching power supplies
  • Industrial motor control systems
  • High-efficiency inverter circuits

Procurement Notes

Verify the specific suffix RT3G against official Microchip documentation to confirm exact reel specifications and tape-and-reel dimensions. Ensure that the SP3F press-in package requirements align with the target PCB design and assembly equipment capabilities before finalizing procurement orders.

Selection Notes

Select this component when a 600V rating and 50A continuous current capacity are required in a press-in format. Consider the CoolMOS SP3F technology for improved switching efficiency compared to standard trench MOSFETs. Evaluate thermal resistance parameters relative to the intended heatsink or board layout constraints.

Part Context

This module belongs to the APTC series of power modules from Microchip Technology. It utilizes the SP3F package variant, which differs from screw-mount alternatives like the T1G suffix by employing a press-in connection method. This family targets high-density power conversion applications.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided source material. Cross-reference with other SP3F package variants such as APTC60HM70RT3G only if electrical ratings meet specific application requirements.

APTCV60HM45RT3GAPTCV60HM45RT3G
$65.79
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