ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
Product Detailed Parameters
- Description：IGBT MODULE 600V 50A 250W SP3
- Series：-
- Mfr：Microsemi Corporation
- Package：Tray
- IGBT Type：Trench Field Stop
- Configuration：Boost Chopper, Full Bridge
- Vce(on) (Max) @ Vge, Ic：1.9V @ 15V, 50A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：SP3
- Supplier Device Package：SP3
- Voltage - Collector Emitter Breakdown (Max)：600 V
- Current - Collector (Ic) (Max)：50 A
- Power - Max：250 W
- Current - Collector Cutoff (Max)：250 µA
- Input Capacitance (Cies) @ Vce：3.15 nF @ 25 V
Download product information
Overview
The APTCV60HM70BT3G is a Trench Field Stop IGBT module manufactured by Microsemi Corporation. It features a 600V collector-emitter breakdown voltage and a continuous current rating of 50A. The device is housed in an SP3 package with a maximum power dissipation of 250W. This component supports boost chopper and full bridge configurations, utilizing advanced trench field stop technology for efficient power switching applications.
Feature Summary
- Utilizes Trench Field Stop IGBT technology for optimized performance
- Designed for boost chopper and full bridge circuit configurations
- Housed in compact SP3 package format
Applications
- Boost chopper circuits
- Full bridge inverter systems
- Industrial power conversion modules
Procurement Notes
This component is classified as obsolete by the manufacturer. Verify availability through secondary market channels or authorized distributors handling legacy inventory. Confirm exact package condition and authenticity before acquisition, as supply chain status may vary significantly for discontinued semiconductor devices.
Selection Notes
Select this module for applications requiring 600V isolation and 50A continuous current handling within SP3 form factors. Ensure thermal management solutions support the 250W dissipation limit. Consider alternative active series parts if long-term supply stability is required for new designs.
Part Context
Part of Microsemi's Power Control portfolio featuring Trench Field Stop technology. Designed for high-efficiency switching in industrial and solar energy applications. Represents legacy generation components now superseded by newer product lines within the manufacturer's catalog.
Replacement Considerations
Public confirmed substitute part numbers are not available in provided documentation. Consult Microsemi official resources for current active replacements within the same voltage and current specifications.
